Semes Co., Ltd.

Dong Ok Ahn

Sang Hyun Son

Yong Jun Seo

Jong Min Lee

Su Jin Chae

Young Ho Park

Jae Myoung Lee

Ji Hoon Yoo

Kwang Sup Kim

Jun Ho Oh

Yong-Jun Seo

Sang Min Ha

Ji Su Hong

A temperature measuring apparatus with improved accuracy is provided. The temperature measuring apparatus comprises a test substrate having a thermal conductivity, a circuit board layer laminated on the test substrate and including a plurality of through holes exposing a top surface of the test substrate, bonding agent disposed in the plurality of through holes and having a thermal conductivity, and a plurality of sensors disposed on the bonding agent and for measuring a temperature.

Apparatus for temperature measurement and method of processing substrate

Disclosed is an apparatus for precisely monitoring warpage deformation of a substrate. The apparatus includes a sensing unit and a processor. The sensing unit is removably mounted on the substrate and detects information on the warpage deformation of the substrate during a treatment process performed on the substrate. The processor generates warpage state information on the basis of the warpage information detected by the sensing unit.

Apparatus for and method of monitoring warpage of substrate, substrate treatment apparatus, and substrate-type sensor

The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.

Wafer type sensor unit and data acquisition method using the wafer type sensor unit

Disclosed are an apparatus and a method for quickly and accurately inspecting a droplet on a substrate. An apparatus for inspecting a droplet on a substrate according to an exemplary embodiment of the present disclosure includes: an ultrasonic sensor configured to apply an ultrasonic wave to a droplet on the substrate and detect an ultrasonic wave reflected from the substrate; and a processor configured to acquire a height of the droplet at each position on the substrate on the basis of a signal of the ultrasonic wave reflected from the droplet on the substrate, calculate a volume of the droplet on the basis of the heights of the droplet at the positions, and store or output data in relation to the volume of the droplet. The embodiment of the present disclosure may calculate the volume of the droplet using the ultrasonic wave, thereby quickly and accurately inspecting the droplet on the substrate.

Apparatus and method for inspecting droplet

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Anyang-si, South Korea

Dong Ok Ahn