Samsung Electronics Co., Ltd.

Dong-myung Shin

Kyung-wook Hwang

Hak-hwan Kim

Ju-heon Yoon

Jeong-Hee Kim

Dae-sup Kim

Kwang-seok Yun

Provided is a light-emitting device including: a substrate; a light-emitting structure formed on the substrate; a first transmissive conductive layer on the light-emitting structure; a first dielectric pattern layer formed on the first transmissive conductive layer, the first dielectric pattern layer including a plurality of openings; a second transmissive conductive layer conformally formed on the first transmissive conductive layer exposed through the plurality of openings and on the first dielectric pattern layer; a second dielectric pattern layer filling the plurality of openings; and a reflective electrode layer formed on the second transmissive conductive layer and the second dielectric pattern layer.

Light-emitting device, package including the same, and method of manufacturing the same

An LED package includes a substrate, a light-emitting structure provided on the substrate, an electrode structure provided on the light-emitting structure, and an external connection terminal provided on the electrode structure, the external connection terminal comprising a major axis and a minor axis. The major axis of the external connection terminal is perpendicular to a cleaving plane of the substrate.

Light-emitting diode package

Growing community of inventors

Hwaseong-si, South Korea

Dong-myung Shin