Lg Chem, Ltd

Lg Energy Solution, Ltd.

Dong-Mok Shin

Min-Jin Ko

Seung-Beom Cho

Byeong-In Ahn

Na-ri Kim

Sang-Soon Choi

Eun-Mi Choi

Keong-Yeon Yoon

Young-Ji Tae

Myoung-hwan Oh

Jang-Yul Kim

Jong-Pil Kim

Jun-seok Nho

Jang Yul Kim

Kyung-Hwan Yoon

Dong-Oh Shin

Kwang-Ho Yoo

Seong-Wook Kang

Hyun-Chul Ha

Jun-Seok Nho

Jae-Sung Han

Ah-Ram Kim

Chang-Hoon Sin

Na-Ri Kim

Disclosed is a method for manufacturing a dry electrode. The method allows determination of the micro-fibrilization degree of a binder resin from the crystallinity of the binder resin. Based on this, the processing conditions of mixed powder for electrode or an electrode film may be controlled. In this manner, it is possible to check and control the processing conditions easily and efficiently. In addition, the method for manufacturing a dry electrode includes a kneading step using a kneader under a low speed and high temperature and pulverization step. Therefore, there is no problem of blocking of a flow path caused by aggregation of the ingredients, which is favorable to mass production.

Electrode for electrochemical device comprising dry electrode film and method for manufacturing the same

The present invention relates to a polyurethane resin composition for a support pad including a polyurethane resin, a DMF solvent, an anionic surfactant, and polyethylene glycol (PEG), and a polyurethane support pad including the polyurethane resin composition for a support pad. According to the present invention, long and large pores may be uniformly formed therein, and thus a support pad having an excellent compression rate and compression recovery rate may be provided.

Polyurethane resin composition for support pad and polyurethane support pad using the same

The present invention relates to a polyurethane resin composition including a first polyurethane resin and a second polyurethane resin that are different from each other in their compositions, an organic solvent, and a surfactant, and a polyurethane mounting pad manufactured from the resin composition.

Poly-urethane resin and poly-urethane absorbing pad using the same

The present invention relates to a slurry for chemical mechanical polishing, comprising an abrasive; an oxidant; an organic acid; and a polymeric additive comprising polyolefin-polyalkyleneoxide copolymer, wherein the polyolefin-polyalkyleneoxide copolymer comprises a polyolefin repeat unit and two or more polyalkyleneoxide repeat units, and at least one polyalkyleneoxide repeat unit is branched.

Slurry for chemical mechanical polishing

This disclosure relates to a polishing pad for chemical mechanical polishing, having a shape where 3 or more semi-oval or semicircular curves that connect 2 valleys neighboring on the plane are connected, and including 2 or more modified patterns that are formed to a determined thickness on the polishing pad, wherein a peak of one modified pattern and a valley of another modified pattern neighboring thereto are sequentially located on the same line. The polishing pad may uniformly disperse slurry over the whole area during a polishing process to provide improved polishing uniformity, and appropriately control residence time of the slurry to increase polishing rate.

Polishing pad for chemical mechanical polishing apparatus

The present invention relates to a CMP slurry composition comprising an abrasive particle; a dispersant; an ionic polymer additive; and a non-ionic polymer additive including a polyolefin-polyethylene glycol copolymer including at least two polyethylene glycol repeat unit as a backbone and at least a polyethylene glycol repeating unit as a side chain, and a polishing method with using the slurry composition. The CMP slurry composition shows a low polishing rate to a single-crystalline silicon layer or a polysilicon layer and a high polishing rate to a silicon oxide layer, resulting in having an excellent polishing selectivity.

Slurry composition for CMP, and polishing method

This disclosure relates to a polyurethane resin composition for a mounting pad, including a polyurethane resin, C9-15 alkyl benzene sulfonic acid or a salt thereof, and a DMF solvent, and a polyurethane mounting pad using the same, whereby long and large pores may be uniformly formed thereinside to provide a mounting pad having low hardness, excellent compressibility, and a high compression modulus.

Polyurethane resin composition for mounting pad and polyurethane mounting pad using the same

In a method for preparing cerium carbonate powder by mixing a cerium precursor solution with a urea solution and carrying out a precipitation reaction, wherein the cerium carbonate powder has a hexagonal crystal structure, by using at least one type of organic solvent as a solvent for either or both the cerium precursor solution and the urea solution, and adjusting temperature of the precipitation reaction within a range of 120&#xb0; C. to 300&#xb0; C. Also, the method can yield cerium carbonate powder, cerium oxide powder from the cerium carbonate powder, and CMP slurry including the cerium oxide powder as an abrasive. In the method, urea as a precipitant can improve the uniformity of a reaction, and thus it is possible to easily and inexpensively obtain cerium carbonate powder with a hexagonal crystal structure without the danger by high-temperature high-pressure and the need for an expensive system in hydrothermal synthesis.

Method for preparing cerium carbonate powder using urea

Disclosed is CMP slurry, which includes a pyridine-based compound including at least two pyridinyl groups, and minimizes the occurrence of dishing and erosion of a wiring line.

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Daejeon, South Korea

Dong-Mok Shin