Samsung Electro-mechanics Co., Ltd.

Hynix Semiconductor Inc.

Skhynix Inc.

Samsung Electronics Co., Ltd.

Merck Patent Gmbh

Egtm Co., Ltd.

Dong Kyun Lee

Byung Woo Kang

Burhanettin Koc

Chuel Jin Park

Cheol Hwan Park

Ho Jin Cho

Jung Ho Ryu

Jung Seok Lee

Soo Cheol Lim

Byung Hoon Kang

Won Seob Oh

Jung Wook Hwang

Ki Mun Paik

Jae Soo Kim

Hyun Phill Ko

Sang Min On

Jae Hyuk Park

Chul Yeub Han

Sung Won Min

Sang Hyun Lee

Tae Young Lee

Eun Ae Jung

Sang Jae Park

Hyoung Jun Jeon

Sun Young Baik

Sung Jun Ji

Yoon Young Choi

Byeong Il Yang

Changhyun Jin

Shin Beom Kim

Tae Hwan Lim

Hyun Sik Noh

Ki Mun Baik

Youn Kyun Bin

Gui Youn Lee

Jang Keun Sim

Jae Chul Lee

Younghun Byun

Jooyong Kim

Kyoung-Mun Kim

Su Pill Chun

Sung Deuk Kim

Sang Oh Lee

Ki Mun Park

An atomic layer etching method using a ligand exchange reaction may include a substrate providing step of putting a substrate with a thin film formed thereon into a reaction chamber, a halogenated thin film forming step of forming a halogenated thin film on a surface of the thin film by infusing a halogenated gas into the reaction chamber, and an etching step of etching the halogenated thin film by infusing a ligand without a metal or metal precursor into the reaction chamber with the substrate with the halogenated thin film.

Atomic layer etching method using ligand exchange reaction

According to the embodiment of the present disclosure, an organo tin compound is represented by the following Chemical Formula 1:

Organo tin compound for thin film deposition and method for forming tin-containing thin film using same

Provided is a method of manufacturing a semiconductor device. The method includes providing a substrate in which a main area including a first cell area and a first peripheral area, and an edge area including a second cell area and a second peripheral area are defined, sequentially forming a mold layer, a supporter layer, a mask layer, and a preliminary pattern layer on the substrate, exposing the preliminary pattern layer to light to simultaneously form a first pattern and a second pattern on the mask layer of the first cell area and the second cell area, respectively, forming an etch stop layer on the second pattern and etching the mask layer using the etch stop layer and the first pattern to form a hole pattern in the mold layer and the supporter layer of the first cell area.

Method of manufacturing semiconductor device

Disclosed herein is a camera module including: a lens barrel in which one or more lenses are installed; a housing accommodating the lens barrel; a printed circuit board coupled with a bottom of the housing and having an image sensor with a light receiving portion mounted thereon; a window film having a window formed therein to define an incident area of light incident on the image sensor; and an infrared ray blocking member blocking an infrared ray in the light incident on the image sensor.

Camera module including an infrared ray blocking member and a window film which block noise light

A lens actuating module for realizing focus adjustment and optical zooming. The lens actuating module includes a rod which is disposed on one side of a lens barrel on which at least one lens is mounted, and has an axis direction corresponding to an optical axis direction of the lens barrel, a driving force transmission member which has a conjoining recess to be conjoined with an outside surface of the rod and has magnetism so as to be conjoined with the outside surface of the rod due to a magnetic force, and a piezoelectric actuator which is disposed on one side of the driving force transmission member in the optical axis direction to provide an axis direction driving force to the rod via the driving force transmission member.

Lens actuating module

A camera module having an auto-focus apparatus comprises a piezoelectric actuator configured to generate a force for moving a driven member, a rod connected to the piezoelectric actuator and configured to transmit the force of the piezoelectric actuator to the driven member, a lens barrel having at least one lens, and a connecting member configured to use magnetic force to couple the rod and the lens barrel together.

Camera module having auto-focus apparatus

Disclosed herein is a lens actuating module for realizing focus adjustment and optical zooming. The lens actuating module includes a rod which is disposed on one side of a lens barrel on which at least one lens is mounted, and has an axis direction corresponding to an optical axis direction of the lens barrel, a driving force transmission member which has a conjoining recess to be conjoined with an outside surface of the rod and has magnetism so as to be conjoined with the outside surface of the rod due to a magnetic force, and a piezoelectric actuator which is disposed on one side of the driving force transmission member in the optical axis direction to provide an axis direction driving force to the rod via the driving force transmission member.

An embodiment of the invention includes a pillar type capacitor where a pillar is formed over an upper portion of a storage node contact. A bottom electrode is formed over sidewalls of the pillar, and a dielectric film is formed over pillar and the bottom electrode. A top electrode is then formed over the upper portion of the dielectric film.

Method for forming pillar type capacitor of semiconductor device

Disclosed herein is an image stabilization mechanism for a camera module. The image stabilization mechanism includes a base, a movable stage receiving a lens barrel therein and having a magnet, and a piezoelectric actuator. The piezoelectric actuator is installed to the base, moves the movable stage in an X-axis or Y-axis direction to remove shake of the lens barrel, and maintains contact with the movable stage because of magnetic attractive force between the piezoelectric actuator and the magnet. The image stabilization mechanism reduces the number of components, thus simplifying the structure and minimizing an increase in height.

Image stabilization mechanism for camera module

A semiconductor device having a high aspect cylindrical capacitor and a method for fabricating the same is presented. The high aspect cylindrical type capacitor is a stable structure which is not prone to causing bunker defects and losses in a guard ring. The semiconductor device includes the cylindrical type capacitor structure, a storage node oxide, a guard ring hole, a conducive layer, and a capping oxide. The cylindrical type capacitor structure in a cell region includes a cylindrical type lower electrode, a dielectric and an upper electrode. The storage node oxide is in a peripheral region over the semiconductor substrate. The conductive layer coating the guard ring hole. The guard ring hole at a boundary of the peripheral region that adjoins the cell region over the semiconductor substrate. The capping oxide partially fills in a part of the conductive layer. The gapfill film filling in the rest of the conductive layer.

Semiconductor device having a high aspect cylindrical capacitor and method for fabricating the same

Disclosed herein is a camera module. The camera module includes a lens barrel having at least one lens which brings an image of a subject into focus. A housing having a space for the lens barrel, and friction member formed in axially. A piezoelectric actuator provided in an outer circumferential surface of the lens barrel, and generating vibration when external voltage is applied to the piezoelectric actuator, with a through hole formed for having the friction member. An elastic member include the friction member, and inserted into the through hole of the piezoelectric actuator, and applying the vibrations to the friction member.

Camera module

Disclosed herein is a lens actuating module. In the lens actuating module, a housing has an installation space therein. A lens barrel is disposed in the installation space of the housing. The lens barrel includes a lens. An actuating means is provided at a first position in the installation space of the housing in an optical axial direction. The actuating means is connected to the lens barrel to move the lens barrel. A base magnet is provided at a second position in the installation space of the housing. A lens magnet is mounted to the outer surface of the lens barrel at a position facing the base magnet to generate a repulsive force between the lens magnet and the base magnet.

A semiconductor device having a high aspect cylindrical capacitor and a method for fabricating the same is presented. The high aspect cylindrical type capacitor is a stable structure which is not prone to causing bunker defects and losses in a guard ring. The semiconductor device includes the cylindrical type capacitor structure, a storage node oxide, a guard ring hole, a conductive layer, and a capping oxide. The cylindrical type capacitor structure in a cell region includes a cylindrical type lower electrode, a dielectric and an upper electrode. The storage node oxide is in a peripheral region over the semiconductor substrate. The conductive layer coating the guard ring hole. The guard ring hole at a boundary of the peripheral region that adjoins the cell region over the semiconductor substrate. The capping oxide partially fills in a part of the conductive layer. The gapfill film filling in the rest of the conductive layer.

The piezoelectric vibrator includes the piezoelectric bar having a plurality of piezoelectric plates alternately stacked and a plurality of vibration sectors divided vertically and horizontally with respect to the direction in which the piezoelectric plates are stacked. Electrode terminals are formed on each of surface regions of the piezoelectric plate, divided in a longitudinal direction thereof, and jump terminals corresponding to electrode terminals are formed on a surface of an adjacent one of the piezoelectric plates. On side surfaces of the piezoelectric plates, a plurality of side electrodes are formed, connecting the electrode terminals and the corresponding jump terminals to power the vibration sectors, by which a pair of the vibration sectors diagonally disposed from each other are simultaneously powered. The piezoelectric vibrator is small and easily manufactured and mass-produced with a simple structure.

Piezoelectric vibrator, manufacturing method thereof and linear actuator having the same

A piezoelectric ultrasonic motor includes a piezoelectric stator including a hollow metal tube having a quadrangular cross section and four piezoelectric elements each installed in each outer face of the metal tube; a rotary shaft including a rotation bar inserted into an inner space of the metal tube, an upper rotation member provided around the rotation bar in contact with an upper surface of the piezoelectric stator, the rotation member rotating in response to the strain of the piezoelectric stator, a lower rotation member adapted to restrain the rotation of the rotation bar and contacting a lower surface of the piezoelectric stator and a power transmission member provided at one portion of the rotation bar to transmit the rotation of the rotation member to an object to be transported; and a power supply to apply a supply voltage necessary for the actuation of the piezoelectric stator.

Piezoelectric ultrasonic motor

Growing community of inventors

Seoul, South Korea

Dong Kyun Lee