Samsung Electronics Co., Ltd.

Other

Dong Kwan Kim

Kun Sil Lee

Dong Sik Kim

Bo Ram Kang

Jun Ho Park

Ji-Han Ko

Eui Hyeon Hwang

Ho Geon Song

Won Keun Kim

Dong Ryeol Park

Jay Woo Kim

A method of manufacturing a semiconductor package includes forming a first redistribution structure, forming a plurality of conductive pillars on the first redistribution structure, mounting the first semiconductor chip on the first redistribution structure, forming an encapsulant configured to cover an upper surface of the first redistribution structure, the plurality of conductive pillars, and the first semiconductor chip, planarizing the encapsulant, exposing the plurality of conductive pillars by forming an opening in the planarized encapsulant, and forming a second redistribution structure connected to the plurality of conductive pillars on the first semiconductor chip and the encapsulant. Upper surfaces of the plurality of conductive pillars are located at a lower level than the upper surface of the first semiconductor chip, and an upper surface of a connection via included in the second redistribution structure has a width greater than a width of a lower surface of the connection via.

Semiconductor devices having a conductive pillar and methods of manufacturing the same

A semiconductor package including a semiconductor chip on a package substrate, a transparent substrate on the semiconductor chip, an attachment dam between the semiconductor chip and the transparent substrate, the attachment dam extending along an edge of the semiconductor chip, a first molding layer on the package substrate and surrounding a side surface of the semiconductor chip and including a first epoxy resin, and a second molding layer on the package substrate and filling a space between the semiconductor chip and the first molding layer and including a second epoxy resin. The first epoxy resin includes a first filler containing at least one of silica or alumina. The second epoxy resin includes a second filler containing at least one of silica or alumina. The content of the second filler in the second epoxy resin is greater than a content of the first filler in the first epoxy resin.

Semiconductor package and method for fabricating same

A semiconductor package includes a semiconductor package substrate. An insulating layer is disposed on the semiconductor package substrate. A semiconductor chip is disposed on the semiconductor package substrate and is covered by the insulating layer. A reflective layer is disposed on the insulating layer and is spaced apart from the semiconductor chip. The reflective layer is configured to selectively transmit radiation through to the insulating layer. A protective layer is disposed on the reflective layer.

Semiconductor package having reflective layer with selective transmittance

A semiconductor package can include a substrate and a semiconductor chip on the substrate. A first molding portion can cover the semiconductor chip and can include a first sidewall and a second sidewall opposite each other. A second molding portion can extend on the substrate along the first sidewall and along the second sidewall, where the first molding portion can include a nonconductive material, and the second molding portion can include a conductive material.

Printed circuit boards with anti-warping molding portions and related semiconductor packages and methods of fabricating

The present invention relates to an adaptor for a slit lamp microscope. According to one embodiment of the present invention, the invention provides the advantages of: facilitating the maintenance/repair of a slit lamp microscope since a camera member used for the slit lamp microscope is simply attached or detached; simply and easily inspecting and photographing a subject's eye; and obtaining a high-resolution video or image for the subject's eye at low costs.

Adaptor for slit lamp microscope

Provided is an IV flow controller which adjusts the amount of an IV material supplied to a patient through an IV tube and to which a flushing feature is added. The IV controller according to the present invention includes: a first body unit, a second body unit, a fixed roller, and a driving roller. The fixed roller is fixedly and rotatably arranged, and has a first gear unit and a second gear unit. The driving roller is accommodated such that a portion thereof is exposed, and the driving roller is moved along the lengthwise direction while controlling the flow of the IV when the exposed portion is turned. Also, in the flushing position, the driving roller rotates in cooperation with the first gear unit of the fixed roller across the IV tube so as to flush the latter. The second gear unit of the fixed roller may be configured so as to have a ratchet gear, and the second body unit has a pawl which meshes with the ratchet gear of the fixed roller in order to prevent reverse rotation. According to the present invention, flushing in the reverse direction is prevented by the ratchet gear, and thus medical accidents caused by reverse flushing can be prevented.

IV flow controller having flushing feature

The present invention relates to an apparatus and method for creating a three-dimensional caricature, and more particularly, to an apparatus and method for creating a three-dimensional caricature having a high degree of similarity to user's face by precisely extracting feature point information on facial features and modifying a three-dimensional polygon face basic model based on the feature point information using an ASM technique specialized for faces. The method comprises the steps of detecting the positions of eyes from an input facial image and normalizing the size of the facial image, detecting each initial position for facial features from the normalized facial image, loading ASMs in the normalized facial image so as to correspond to the detected initial position and then extracting feature points for the facial features, and creating a three-dimensional polygon face caricature by modifying the three-dimensional polygon face basic model according to coordinate values of the extracted feature points.

Growing community of inventors

Daejeon, South Korea

Dong Kwan Kim