Skhynix Inc.

Hynix Semiconductor Inc.

Other

Kabushiki Kaisha Toshiba

Dong Keun Kim

Masahiro Takahashi

Tsuneo Inaba

Jung Hyuk Yoon

Min Gu Kang

Ji Wang Lee

Jun Hyun Chun

Dong Uc Ko

Hyun Ju Yoon

Young Su Oh

Akira Katayama

Hyuck Sang Yim

Hyun Joo Lee

Byoung Chan Oh

Ho Seok Em

Tae Hun Yoon

Chae Kyu Jang

Yoon Jae Shin

Sang Kug Lym

Yong Ki Kim

Sun Hyuck Yon

A memory module includes a module substrate, a plurality of memory devices, a first power line, and a second power line. The memory devices are mounted on the module substrate. Each of the memory devices includes a power management member. The first power line may be arranged in the module substrate to provide each of the memory devices with power. The second power line may be electrically connected between the power management members of adjacent memory devices to control and share the power provided to the adjacent memory devices.

Memory module including power line for supplying power to memory devices

A semiconductor apparatus includes a temperature detecting circuit and a temperature raising circuit. The temperature detecting circuit detects a temperature to generate temperature detection information. The temperature raising circuit generates heat through a toggling operation based on the temperature detection information.

Semiconductor apparatus and semiconductor memory apparatus

A memory device may include a bank layer and a control circuit layer. The bank layer may be arranged on a semiconductor substrate. The bank layer may include a plurality of mats. Each of the mats may include a plurality of stacked decks. Each of the decks may include a plurality of memory cells. The control circuit layer may be arranged between the semiconductor substrate and the bank layer. The control circuit layer may include a plurality of control circuit regions corresponding to the mats, respectively. The stacked decks may include a plurality of stacked word lines and a plurality of stacked bit lines intersected with the stacked word lines. A word line decoder, for controlling the word lines, and a bit line decoder, for controlling the bit lines, may be alternately and repeatedly arranged in the control circuit layer.

Memory device including a plurality of stacked memory cells

A semiconductor apparatus may include a repair circuit configured to activate a redundant line of a cell array region by comparing repair information and address information. The semiconductor apparatus may include a main decoder configured to perform a normal access to the cell array region by decoding the address information. The address information may include both column information and row information.

Semiconductor apparatus

A memory system is provided to include a storage device including memory cells for storing data, and a controller in communication with an external device and configured to control the storage device based on a request from the external device. The controller is configured to receive a request from the external device to perform a refresh operation of re-writing stored data in the memory cells, read data from the memory cells included in the storage device, set a refresh period based on a number of fail bits included in the read data and a temperature of the controller or the storage device, and perform the refresh operation of the storage device based on the refresh period.

Controller and memory system for refreshing memory based on fail bits and temperature

There are provided a volatile memory device, and an operating method. The volatile memory device includes: a plurality of memory cells arranged in rows and columns and structured to store data; word lines; bit lines; a row decoder; a column decoder; and a control logic coupled to communicate with the row and column decoders and configured to, in an active period, provide the row decoder with a first command, and provide the column decoder with a second command, wherein the row decoder is further configured to: apply a first word line voltage higher than a ground voltage to a selected word line, from when the first command is provided; and for a duration over which the row decoder is activated, apply either a second word line voltage lower than the first word line voltage to the selected word line or no voltage to the selected word line.

Volatile memory device, storage device, and operating method of decreasing a leakage current

A semiconductor memory apparatus may include a memory bank, a global buffer array, and an input and output circuit. The memory bank includes a local data circuit, and the global buffer array includes a global data circuit. The local data circuit is operably coupled to the global data circuit. The global buffer array may be operably coupled to the input and output circuit. The memory bank is disposed in a core region, and the global buffer array and the input and output circuit may be disposed in a peripheral region separated from the core region.

Semiconductor memory apparatus, operation method of the semiconductor memory apparatus and system including the semiconductor memory apparatus

A resistance variable memory device may include a plurality of tiles in which memory cells are arranged. The first to third level of the word lines may be sequentially stacked on the plurality of tile regions with the decoding circuits along rows of the tile regions. A first level of the bit lines may be interposed between the first level of the word lines and the second level of the word lines. A first level of the bit lines may be extended along columns of the tile regions. The second level of the bit lines may be interposed between the second level of the word lines and the third level of the word lines. The second level of the bit lines may be extended along the columns of the tile regions. The first and third levels of the word lines at a selected row of a selected tile region among the tile regions and the second level of the bit lines at a selected column of the selected tile region may be controlled by a decoding circuit of the selected tile region. The second level of the word line at the selected row of the selected tile region and the first level of the bit line at the selected column of the selected tile region may be controlled by another decoding circuit of another tile region.

Resistance variable memory device including stacked memory cells

According to one embodiment, a memory includes a memory cell array including blocks arranged in a column direction, first and second main global conductive lines each extending from a first end to a second end of the memory cell array in the column direction, a first resistance change element connected between the first and second main global conductive lines inside the memory cell array, a first reference global conductive line extending from the first end to the second end of the memory cell array in the column direction, and a second resistance change element connected to the reference global conductive line outside the memory cell array.

Resistance change memory

A sense amplifier includes an equalization unit configured to precharge a pair of bit lines to a level of a bit line precharge voltage in response to a bit line equalizing signal; and an amplification unit configured to sense and amplify voltages of the pair of bit lines, supply, during an active operation, a ground voltage to a pull-down node of a latch section, and supply, when a precharge signal is enabled, a first voltage lower than the ground voltage to the pull-down node of the latch section for a predetermined time.

Sense amplifier and semiconductor device for securing operation margin of sense amplifier

According to one embodiment, a memory device includes a memory cell, a sense amplifier, and a resistor. The sense amplifier includes a first input and a second input, outputs a signal in accordance with a difference between the first and second inputs, and is selectively coupled at a second input to the memory cell. The resistor is in a first path between the first input of the sense amplifier and a ground node.

Memory device

According to one embodiment, a resistance change memory includes a memory cell, a sense amplifier and a global bit line. The memory cell is disposed at a location where a local bit line and a word line intersect each other. The memory cell is connected to both the local bit line and the word line. The sense amplifier reads data stored on the memory cell by supplying a read current to the memory cell. The global bit line is connected between the local bit line and the sense amplifier. The global bit line feeds the read current supplied by the sense amplifier to the local bit line. The sense amplifier charges the global bit line, before the local bit line and the global bit line are connected to each other.

Growing community of inventors

Icheon-si, South Korea

Dong Keun Kim