Samsung Electro-mechanics Co., Ltd.

Sungkyunkwan University

Dong Jun Jung

Hyun Joon Kim

Eun Jung Lee

Jong Ho Lee

Dae Hee Lee

Sim Chung Kang

Yun Gwan Kim

Jae Sung Park

Ki Myoung Yun

Hye Jin Jeong

Sang Ho Oh

Min Hoe Kim

Zhipeng Wang

Jin Wan Park

Hyun Sik Chae

Hyun Sook Kim

Jong Han Kim

Hae Suk Chung

Hyung Soon Kwon

Hyoung Uk Kim

Yun Jung Park

Tae Young Ham

Yun Hee Kim

Ji Eun Park

Dong Geon Yoo

Su Been Kim

Sun Mi Kim

Soo Jeong Jo

Chang Geon Lee

Dae Jin Shim

Yoon Soo Park

Hye Yun Jeong

A multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed in a first direction with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces. Each of the side margin portions includes a first region adjacent to the internal electrodes, and a second region adjacent to an outside of each of the side margin portions. An average Sn amount of the first region is lower than an average Sn amount of the second region. An Sn amount of the first region gradually increases from a side of the internal electrodes to the second region.

Multilayer electronic component

A multilayer electronic component including a dielectric layer is provided. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-interface shell-shell structure. The dielectric grain having the core-interface shell-shell structure includes a perovskite (BaTiO)-based base main component, a first subcomponent including silicon (Si), and a second subcomponent including at least one selected from the group consisting of manganese (Mn), vanadium (V), chromium (Cr), iron (Fe), nickel (Ni), cobalt (Co), copper (Cu), zinc (Zn), and tin (Sn). An average content of the first subcomponent is highest in the first interface shell region, and an average content of the second subcomponent is highest in the second interface shell region.

A multilayer electronic component includes a body including a dielectric layer and internal electrodes, and including first and second surfaces, third and fourth surfaces, fifth and sixth surfaces, external electrodes disposed on the third and fourth surfaces, and side margin portions disposed on the fifth and sixth surfaces. The side margin portions include a first region adjacent to the internal electrodes and a second region adjacent to outside of the side margin portions. In a Raman spectra obtained by analyzing one point located in the first and second region respectively, peak X appears in a Raman shift of 450 cmto 600 cm. When a minimum value of the Raman shift at which the peak X appears in the Raman spectra of the first region is λ(cm), a minimum value of the Raman shift at which the peak X appears in the Raman spectra of the second region is λ+0.75 cmor greater.

A multilayer electronic component includes: a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces, respectively; and external electrodes disposed on the third and fourth surfaces, respectively. The body includes an active portion including internal electrodes disposed alternately with the dielectric layers in the first direction, one of the internal electrodes includes a central portion and an interface portion disposed between the central portion and one of the dielectric layers, and the interface portion and one of the side margin portions include Sn.

Multilayer electronic component having improved high temperature load life and moisture resistance reliability

A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of crystal grains and a grain boundary disposed between adjacent crystal grains. A ratio (C2/C1) of an Mg content (C2) of the grain boundary to an Mg content (C1) of at least one of the plurality of crystal grains is 3 or more.

Ceramic electronic component and method of manufacturing the same

A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer has a perovskite structure represented by a general formula ABOas a main phase, and includes a region in which Dy is dissolved. In the region in which Dy is dissolved, an atomic ratio of a content of Dy dissolved in an A-site of the perovskite structure to a content of Dy dissolved in a B-site is 1.6 or more and 2.0 or less.

Ceramic electronic component

A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer has a perovskite structure represented by a general formula ABOas a main phase, and includes a region in which Dy is solid solubilized. In the region in which the Dy is solid solubilized, an X-ray count of Dy solid-solubilized in an A-site of the perovskite structure measured by using Scanning Transmission Electron Microscopy-Energy Dispersive X-ray Spectroscopy (STEM-EDS) is AD, an X-ray count of Dy solid-solubilized in a B-site of the perovskite structure is BD, and an average value of AD/BD is 1.6 or more and 2.0 or less.

A multilayer ceramic electronic component includes: a body including dielectric layers as well as a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween and including a first metal; and external electrodes disposed on external surfaces of the body including a second metal, wherein at least some of the plurality of internal electrodes include a core-shell region including the first and second metals, and average contents of the second metal in a core portion and a shell portion of the core-shell region are different from each other.

Multilayer ceramic electronic component

A manufacturing method of a dielectric ceramic composition includes attaching a reactive functional group to a surface of a base material powder particle of a perovskite structure.

Manufacturing method of dielectric ceramic composition and dielectric ceramic composition manufactured by the same

A multilayer ceramic capacitor includes a ceramic body having a dielectric layer disposed between two internal electrodes. The dielectric layer includes a plurality of dielectric grains. A grain boundary between at least two dielectric grains of the plurality of dielectric grains has a ratio Si/Ni of a weight of Si to a weight of Ni in the grain boundary that is at least 1 and 6 or less.

Multi-layered ceramic capacitor

A multilayer electronic component includes: a body including first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively, wherein each of the dielectric layers includes BaTiOand includes a plurality of grains and grain boundaries formed between adjacent grains, and a sum of contents of Si and Dy in the grain boundary is 10 to 15 parts by weight.

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Suwon-si, South Korea

Dong Jun Jung