Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Dong-Jin Park

Jee-Soo Mok

Duck-soo Kim

Chang-Sup Ryu

Yoong Oh

Won-Churl Jang

Dongki Min

Myung-Hee Kang

Seongyeong Jeong

Jeehong Lee

Joonhyuk Im

Byung-Bae Seo

Junam Song

Young-Ho Kim

Pil-Kwon Jun

Sun-Yong Choi

Pil-kwon Jun

Ki-Hwan Kim

Hee-Bum Shin

Kyung-Dae Kim

Hoi-Sik Chung

Jin-sung Kim

Chung-sam Jun

Sang-Mun Chon

Chung-Sam Jun

Kwang-Soo Kim

Yang-Sun Kim

Sang-mun Chon

Jee Hong Lee

June-ing Gil

Jin-Seock Kim

Woo Seok Choi

Je-eung Park

Jeong-Hyun Choi

Jin-ho Hwang

Kwang-Jun Yoon

Youn-Soo Seo

Soon-Jin Cho

Jun-Heyoung Park

Koung-Su Shin

Eung-Suek Lee

Joo-Woo Kim

Il-hyun Sohn

Seung-Chul Kim

In-Hoi Doh

Seog-Young Lim

Tae-Kyoung Kim

Jong-Suk Bae

Chun-Duek Lee

Shang-Oa Park

June-Ing Kil

Seung-Hyun Jung

Sung-Young Kim

An image sensor includes a pixel array including a plurality of normal pixels, a plurality of phase detection groups, and a color filter array. Each phase detection group includes a first phase detection pixel and a second phase detection pixel disposed adjacent to the first phase detection pixel. The color filter array includes a plurality of unit groups. Each unit group includes a plurality of color filters of a same color arranged in an M×N matrix on the pixel array, wherein M and N are natural numbers. A first color filter among the color filters of a first color is disposed on the first phase detection pixel of one of the unit groups and a second color filter among the color filters of a second color different from the first color is disposed on the second phase detection pixel of another one of the unit groups.

Image sensor, application processor and image sensing device

A processing circuitry is configured to generate a first analysis result based on a size of a partial area of a target area when the partial area is captured by only one of a first sensor or a second sensor, based on first image data for the target area captured by the first sensor and second image data for the target area captured by the second sensor, and generate first final image data or second final image data by using the first image data and the second image data, based on the first analysis result. A difference between the first final image data and the second final image data is based on a difference between a first characteristic of the first sensor and a second characteristic of the second sensor.

Processing circuit analyzing image data and generating final image data

An image processing system may include a first image sensor, a second image sensor, and an image processing device. The image processing device may be configured to obtain a first image and a second image by respectively processing the first image data and the second image data. The image processing device may output an image based on the first image when a zoom factor of the output image is lower than a first reference value, generate a correction image by correcting locations of second reference coordinates of the second image based on first reference coordinates of the first image when the zoom factor of the output image is between the first reference value and the second reference value, and may output an image based on the second image when the zoom factor exceeds the second reference value.

Image processing systems for correcting processed images using image sensors

A method of operating a mobile device comprises executing a trusted service application in a trusted operating system through secure access, executing a trusted web server module in the trusted operating system, wherein the trusted web server module is configured to transfer information using an internet protocol and the information is generated by execution of the trusted service application, and executing a user application in a rich operating system through normal access, wherein the user application is configured to relay communication between a remote web server and the trusted web server module through a security session.

Operation of mobile device as trusted mobile web client or trusted mobile web server

In a secure boot method, an initial boot loader verifies a first digital signature included in a first boot loader using a public key. The first boot loader is executed if the first digital signature is valid. The first boot loader verifies a first message authentication code included in a second boot loader using a unique key. The second boot loader is executed if the first message authentication code is valid.

Method for generating a secured boot image including an update boot loader for a secured update of the version information

The present invention provides a method for manufacturing a printed circuit board and a print circuit board manufactured thereby, in which through holes of a core board are filled by reverse pulse plating so that it allows to manufacture a core board having greater than 100 &#x3bc;m of a thickness which has been a processing limitation with conventional technologies and form bumps on a thick insulation layer, which has been difficult till now, and thus providing resistance against pressure of paste bumps produced during stacking due to the increased strength of a core board, convenience to join between layers, excellent heat-releasing effect, and collectively stacking of core boards, which was not possible with conventional methods.

Printed circuit board using bump and method for manufacturing thereof

A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.

Method of manufacturing printed circuit board

A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.

Printed circuit board and manufacturing method thereof

A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

Printed circuit board using paste bump and manufacturing method thereof

A manufacturing method of a package on package with a cavity. The method can include forming a first upper substrate cavity in one side of an upper substrate; mounting an upper semiconductor chip on the other side of the upper substrate; forming a lower substrate cavity in one side of a lower substrate; mounting a lower semiconductor chip in the lower substrate cavity formed in the lower substrate; and stacking the upper substrate above the lower substrate such that the first upper substrate cavity accommodates a part of the lower semiconductor chip. The package on package and a manufacturing method thereof can reduce the overall thickness of the package by forming cavities in both upper and lower substrates to accommodate a semiconductor chip mounted in the lower substrate.

Method for manufacturing package on package with cavity

Growing community of inventors

Suwon-si, South Korea

Dong-Jin Park