Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Other

Dong Jin Kim

Jin Han Kim

Yeong Beom Ko

Se Woong Cha

Do Hyung Kim

Ji Hun Lee

Jae Hun Bae

Glenn A Rinne

Jin Young Kim

Joon Dong Kim

Won Myoung Ki

Seungjae Lee

Jong Sik Paek

Doo Hyun Park

Curtis Michael Zwenger

Jun Hwan Park

Sungkyu Kim

Hyun Cho

Seung Nam Son

YoonJoo Kim

Won Chul Do

Dong Hoon Lee

Seung Jae Lee

Sung Kyu Kim

Yoon Joo Kim

Ji Won Choi

Hyun Ah Choo

Won Chul Do Do

Jae Hun Bae Bae

Changjoon Justin Lee

Jun Young Heo

Ki Duk Park

Yun Kyung Kim

Jong-Hyun Park

A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.

Semiconductor device and manufacturing method thereof

A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Package-on-package type semiconductor package

A semiconductor product in the form of a stack chip package and a method of manufacturing the same, where a plurality of semiconductor chips are stacked one on another so as to enable the exchange of electrical signals between the semiconductor chips, and where a conductive layer is included for inputting and outputting signals to and from individual chips. A stack chip package having a compact size may, for example, be manufactured by stacking, on a first semiconductor chip, a second semiconductor chip having a smaller surface area by means of interconnection structures so as to enable the exchange of electrical signals between the first and second semiconductor chips, and by using a conductive layer for inputting and outputting signals to and from individual semiconductor chips, in lieu of a thick substrate. Furthermore, heat dissipation effects can be enhanced by the addition of a heat dissipation unit.

Wafer-level stack chip package and method of manufacturing the same

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Method of manufacturing a package-on-package type semiconductor package

A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Manufacturing method of semiconductor device and semiconductor device thereof

Growing community of inventors

Gwangju, South Korea

Dong Jin Kim