Samsung Electronics Co., Ltd.

Skhynix Inc.

Dong Hyuk Chae

Jun Jin Kong

Kyoung Lae Cho

Seung-Hwan Song

Sung Lae Oh

Sung Chung Park

Sang Woo Park

Nam Phil Jo

Sang-Wan Nam

Seung Jae Lee

Chi Weon Yoon

Ki Soo Kim

Jae Hong Kim

Dong Ku Kang

Jung-Yun Yun

Dongku Kang

Young Ho Lim

Young Hwan Lee

Yong June Kim

Heeseok Eun

Sung-Jae Byun

Bo Geun Kim

Sang Yong Yoon

Tae Hun Kim

Seung Hoon Lee

Sung Soo Lee

Mi Sun Yoon

Yoon Sun Park

Chan Ho Yoon

Dong Gu Kang

Donghun Yu

Hee Joung Park

Dong Hun Yu

Kyeong Seung Kang

Won Chul Shin

Hyun Chul Cho

Kyong Lae Cho

A three-dimensional semiconductor device may comprise a first cell region, a second cell region, and a via plug region disposed between the first cell region and the second cell region; a word line stack disposed in the first cell region, the via plug region, and the second cell region, the word line stack including a plurality of word lines and a plurality of interlayer insulating layers which are alternately stacked; and a plurality of via plugs exclusively connected to the plurality of the word lines, respectively, by vertically penetrating through the word line stack in the via plug region. The via plugs may have an arrangement of a zigzag pattern in a row direction from a top view. The diameters of the via plugs may increase in the row direction.

Three-dimensional semiconductor device

At least one address scheduling method includes selecting a first bit line, selecting a first string connected to the first bit line, performing address scheduling on N pages of each of multi-level cells in the first string sequentially from a bottom word line to a top word line, and after completing the address scheduling on all word lines in the first string, performing address scheduling on second to k-th strings sequentially in the same manner as performed with respect to the first string, where 'k' is 2 or a natural number greater than 2.

Address scheduling methods for non-volatile memory devices with three- dimensional memory cell arrays

A memory may include a first wafer, and a second wafer stacked on and bonded to the first wafer. The first wafer may include a cell structure including a memory cell array; and a first logic structure disposed under the cell structure, and including a row control circuit. The second wafer may include a second logic structure including a column control circuit.

Memory device having vertical structure including a first wafer and a second wafer stacked on the first wafer

A memory device includes: a first wafer including a first substrate, a plurality of first electrode layers and a plurality of first interlayer dielectric layers alternately stacked along first vertical channels projecting in a vertical direction on a top surface of the first substrate, and a dielectric stack comprising a plurality of dielectric layers and the plurality of first interlayer dielectric layers alternately stacked on the top surface of the first substrate; and a second wafer disposed on the first wafer, and including a second substrate, and a plurality of second electrode layers that are alternately stacked with a plurality of second interlayer dielectric layers along second vertical channels projecting in the vertical direction on a bottom surface of the second substrate and have pad parts overlapping with the dielectric stack in the vertical direction.

Memory device, memory system having the same, and write method thereof

Address scheduling methods for non-volatile memory devices with three-dimensional memory cell arrays

A memory device is disclosed. The disclosed memory device may include a first wafer, and a second wafer stacked on and bonded to the first wafer. The first wafer may include a cell structure including a memory cell array; and a first logic structure disposed under the cell structure, and including a column control circuit. The second wafer may include a second logic structure including a row control circuit.

A memory device having a vertical structure includes a memory cell array defined in a cell wafer, and having a plurality of word lines extending in a first direction and arranged in a second direction, and having a plurality of bit lines extending in the second direction and arranged in the first direction; and a logic circuit configured to control the memory cell array, and including a page buffer low-voltage circuit, a page buffer high-voltage circuit, a row decoder circuit and a peripheral circuit, wherein the page buffer low-voltage circuit is disposed in a first peripheral wafer and the page buffer high-voltage circuit, the row decoder circuit and the peripheral circuit are disposed in a second peripheral wafer, and wherein the cell wafer overlaps with the first peripheral wafer and the second peripheral wafer in a vertical direction that is perpendicular to a plane formed by the first direction and the second direction.

Memory device having logic circuit distributed across two peripheral wafer

A memory device includes a cell wafer including a memory cell array; a first logic wafer bonded to one surface of the cell wafer, and including a first logic circuit which controls the memory cell array; and a second logic wafer bonded to the other surface of the cell wafer which faces away from the one surface, and including a second logic circuit which controls the memory cell array.

Memory device having vertical structure

A memory device includes a first memory block defined in a first wafer; and a second memory block defined in a second wafer that is disposed in a vertical direction with respect to the first wafer. A size of the first memory block is smaller than a size of the second memory block.

Provided herein is a memory device and a method of operating the same. The memory device may include a memory cell array including a plurality of memory cells, page buffers coupled to the memory cell array through respective bit lines and a control logic configured to control so that, during a read operation, data stored in the memory cell array is sensed and stored in the page buffers, and the data stored in the page buffers is output to an external device, wherein the control logic controls a time point at which a discharge operation is to be performed after the sensing of the data, and a time point at which a data transfer operation between latches included in each of the page buffers is to be performed, in response to a read command received from the external device.

Memory device and method of operating the same

A memory device includes a plurality of memory cells, bit lines connected to the plurality of memory cells, and page buffers coupled to the plurality of memory cells through the bit lines, and performing a read operation on the plurality of memory cells, wherein each of the page buffers comprises: a first latch controlling a bit line precharge operation during the read operation; and a second latch storing a result of a first sensing operation and a result of a second sensing operation performed after the first sensing operation, wherein a value stored in the second latch is inverted when the result of the first sensing operation and the result of second sensing operation are different from each other during the second sensing operation.

Memory device and operating method therefor

Growing community of inventors

Seoul, South Korea

Dong Hyuk Chae