Samsung Electro-mechanics Co., Ltd.

S-cera Co., Ltd.

Dong Hwan Seo

Kang Heon Hur

Sung Hyung Kang

Sang Hyun Park

Chang Ho Lee

Jong Kuk Hong

Sang Koo Kwon

Doo Young Kim

Eun Sang Na

Jong Hee Kim

Youn Kyu Choi

Jin Yung Ryu

Hyuk Joon Youn

Soon Mok Choi

Hyeon Pyo Jeon

A multilayer ceramic electronic component includes a ceramic main body having internal electrodes laminated therein; and external electrodes formed on ends of the ceramic main body in a length direction, wherein each external electrode includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is thickness of a cover layer, Te is thickness of the internal electrode, Td is distance between neighboring internal electrodes, Lis length from either end of the ceramic main body in the length direction in a region in which the cover layer adjoins a margin part of the ceramic main body to an end of the first layer formed on an upper or lower surface of the ceramic main body, and Lm is length of the margin part, Tc&#x2266;70 &#x3bc;m and L&#x3c;Lm+Tc&#xd7;cot 50&#xb0; are satisfied.

Multilayer ceramic electronic component

There is provided a multilayer ceramic electronic component, including: a ceramic main body having internal electrodes laminated therein; and external electrodes formed on both ends of the ceramic main body in a length direction thereof, wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is a thickness of a cover layer of the ceramic main body, Lis a length from either end of the ceramic main body in the length direction thereof to an end of the first layer formed on an upper surface or a lower surface of the ceramic main body, Tis a thickness of the first layer, and Tis a thickness of the second layer, Tc&#x2266;70 &#x3bc;m, T&#x2267;(1.5)T, and L&#x3c;(1.5)Tc are satisfied, thus providing excellent reliability.

There is provided a ceramic electronic component including a ceramic sintered body, internal conductive layers, and external electrodes. Each of the external electrodes includes a first electrode layer, a conductive resin layer covering the first electrode layer, and a second electrode layer covering the conductive resin layer and having an extension length greater than the length of the first electrode layer extending from one of the side surfaces of the ceramic sintered body to the portions of the top and bottom surfaces thereof. The distance from the top or bottom surface of the ceramic sintered body to the closest layer of the internal conductive layers is greater than or equal to the length of the first electrode layer extending from one of the side surfaces of the ceramic sintered body to the portions of the top and bottom surfaces thereof.

Ceramic electronic component

Disclosed herein is a method of deagglomerating ceramic powder to inhibit agglomeration and provide a uniform particle size, a deagglomeration mill used for the above method, and a method of preparing uniformly mixed ceramic slurry using the deagglomerated ceramic powder. The deagglomeration method of the ceramic powder includes loading a mixture of ceramic powder and solvent into the deagglomeration mill which includes a hollow cylindrical mill cover having a diameter larger than a length and having a plurality of beads therein; rotating an impeller of a main shaft disposed longitudinally at an internal center portion of the mill cover at a peripheral velocity of 6&#x2013;10 m/s, using a driving means; deagglomerating the ceramic powder by the action of beads which are moved by a rotational force of the impeller; and discharging the mixture of ceramic powder and solvent from the deagglomeration mill.

Method of deagglomerating ceramic powder, deagglomeration mill used therefor and method of preparing highly dispersed slurry using the deagglomerated powder

Disclosed herein is a small particle oxide powder for dielectrics. The oxide powder has a perovskite structure, an average particle diameter [D50(&#x3bc;m)] of 0.3 &#x3bc;m or less, a particle size distribution of the average particle diameter within 3%, a particle size distribution satisfying a condition D99/D50&#x3c;2.5, a content of OHgroups of 0.2 wt % and a C/A axial ratio of 1.006 or more. A method of manufacturing the oxide powder comprises the steps of mixing TiOparticles and a compound solved with at least one element represented by A of the perovskite structure of ABO; drying and pulverizing the mixture of TiOand the compound; calcining the pulverized mixture; adding the oxide containing the elements of the site A to the coated TiOparticles and wet-mixing, drying and pulverizing; primarily calcining and pulverizing the pulverized powder under vacuum; and secondarily calcining and pulverizing the powder.

Oxide powder for dielectrics, method of manufacturing oxide powder for dielectrics, and multi-layer ceramic capacitor using the same

A low temperature sinterable dielectric ceramic composition, as well as a multilayer ceramic chip capacitor and a ceramic electronic device. The dielectric ceramic composition comprises a major composition represented by the general formula: x{&#x3b1;BaO, (1&#x2212;&#x3b1;)SrO}-y{SiO}-z{(1&#x2212;&#x3b2;)ZrO, &#x3b2; AlO} (wherein x, y and z are weight percentages; x+y+z=100, 55&#x2266;x&#x2266;75, 10&#x2266;y&#x2266;35, and 5&#x2266;z&#x2266;30, &#x3b1; and &#x3b2; are moles; 0.4&#x2266;&#x3b1;&#x2266;0.8, and 0.01&#x2266;&#x3b2;&#x2266;0.07) and 2 to 10 parts by weight of a Zn&#x2014;B-silicate glass composition, per 100 parts by weight of the major composition. The multilayer ceramic chip capacitor and a multilayer ceramic circuit board for the electronic device comprise a plurality of dielectric ceramic layers, internal electrodes arrayed inside the dielectric ceramic layers, and outer electrodes electrically connected to the internal electrodes, characterized in that the dielectric ceramic layer is a sintered body of the dielectric ceramic composition mentioned above, and the internal electrode is made of a conductive base metal material.

Low temperature sinterable dielectric ceramic composition, multilayer ceramic chip capacitor and ceramic electronic device

Piezoelectric ceramic composition and piezoelectric ceramic device using the same

Disclosed is a piezoelectric ceramic composition comprising a PZT piezoelectric composition, a B-site of which is substituted with a certain material, and chromium oxide, and a piezoelectric device using the piezoelectric ceramic composition. The piezoelectric ceramic composition has good heat resistance and frequency stability, and reduces a leakage current. There is provided the piezoelectric ceramic composition comprising a main component expressed by Pb&lsqb;(Co W ) Ti Zr &rsqb;O (wherein, 0.001&lE;x&lE;0.04, and 0.35 &lE;y&lE;0.55), Cr O in an amount of 0.01 to 2 wt %, MnO in an amount of 0.1 to 0.5 wt %, and an additive in an amount of 0.01 to 2.0 wt %, based on the total weight of the piezoelectric ceramic composition, in which the additive is selected from the group consisting of CoO, MgO, ZnO, Al O , Fe O , Sb O , SnO , CeO , Nb O , V O and WO , and mixtures thereof. The piezoelectric ceramic composition satisfies piezoelectric properties such as kp and Qm needed for a piezoelectric material, and is 320&deg; C. or higher in phase transition temperature, &plusmn;30 ppm/&deg; C. in TCF, and 0.1% or less in oscillation frequency change after reflow; and the piezoelectric ceramic composition also has good piezoelectric properties such that the leakage current is reduced.

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Suwon, South Korea

Dong Hwan Seo