Samsung Electronics Co., Ltd.

Dong-Hun Yi

Yong-Jin Lee

Jong-Keun Jeon

Kee-Seok Kim

Jung-Hwan Kim

Un-Byoung Kang

Yongjin Lee

Hyung-Sun Jang

Jongkeun Jeon

Keeseok Kim

Woonseong Kwon

An image sensor module and an imaging device. An image sensor package includes a plurality of image sensor chips for generating image signals and a lower transparent board over the image sensor chips. An upper transparent board is positioned over the lower transparent board and includes a lens for focusing an external light to the image sensor chips. An adhesion member is interposed between the upper transparent board and the lower transparent board, and thus the upper and lower transparent boards are adhered to each other by the adhesion member such that the lens and the image sensor chips are aligned with each other. A dehumidifying agent is arranged in the adhesion member to absorb moistures from an interior of the image sensor module. Accordingly, the moistures are prevented from being condensed onto the surface of the image sensor module.

Method of manufacturing an image sensor module

Image sensor module having a wafer level chip size package and method of manufacting the same and imaging device including the image sensor module and method of manufacturing the image device

Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern.

Semiconductor package and method of manufacturing the same

Growing community of inventors

Asan-si, South Korea

Dong-Hun Yi