Samsung Electronics Co., Ltd.

Samsung Mobile Display Co., Ltd.

Dong-ho Lee

Jeo-young Shim

Tae-han Jeon

Hyun-Soo Chung

Kun-sun Eom

Hee-jeong Jeong

Dong-Hyeon Jang

Yong-Chai Kwon

In-Young Lee

Seong-deok Hwang

Seung-Duk Baek

Seong-ho Cho

Sun-Won Kang

Joo-ho Lee

Donghan Kim

Tae-Soo Kim

Sang-Wook Park

Kang-Wook Lee

Joong-Hyun Baek

Keum-Hee Ma

Ki-Hyuk Kim

Heejeong Jeong

Myeong-Soon Park

Ju-il Choi

Myung-Kee Chung

June-young Lee

Hae-Hyung Lee

Jin-Yang Lee

Jin-seok Jang

Jae-Shin Cho

Jae-mo Chung

Jin-hee Sung

So-bo Chung

Jeong-su Kim

Seung-duk Baek

Disclosed is an oven having a sensor for sensing the air inside a cooking chamber so as to enable the cooked state of food materials to be recognized. The disclosed oven comprises: the cooking chamber; a first passage part disposed outside the cooking chamber so as to communicate with the cooking chamber; the sensor disposed inside the first passage part; a second passage part isolated from the first passage part, and through which forcibly suctioned external air is transferred; and an inlet and an outlet, which allow the first and second passage parts to communicate with each other, wherein, when the inlet is closed, the air inside the cooking chamber flows into the first passage part, and then passes through the sensor so as to be discharged through the outlet, and when the inlet is opened, the air flowing from the second passage part to the first passage part through the inlet passes through the sensor together with the air flowing into the first passage part from the inside of the cooking chamber so as to be discharged through the outlet.

Oven

Provided are a nanopore device with resolution improved by graphene nanopores, and a method of manufacturing the same. The nanopore device includes: a first insulating layer; a graphene layer disposed on the first insulating layer and having a nanopore formed at a center portion of the graphene layer; and first and second electrode layers disposed respectively at both sides of the nanopore on a top surface of the graphene layer, wherein a center region of the first insulating layer is removed such that the center portion of the graphene layer is exposed to the outside.

Nanopore device including graphene nanopore and method of manufacturing the same

A nanosensor may include a substrate that has a hole formed therein, a first insulating layer that is disposed on the substrate and has a nanopore formed therein, first and second electrodes that are disposed on the first insulating layer and are spaced apart from each other, first and second electrode pads that are disposed on the first and second electrodes, respectively, and a protective layer disposed on the first and second electrode pads. A method of manufacturing a nanosensor may include forming a first insulating layer, graphene, and a metal layer on a substrate, patterning the metal layer and the graphene, forming a protective layer on a portion of the graphene and the metal layer, exposing a portion of the graphene by removing a portion of the protective layer, forming a hole in the substrate, and forming a nanopore in the first insulating layer and the graphene to be connected to the hole.

Nanosensor and method of manufacturing same

A biomolecule detection apparatus comprising a nanopore device having a front surface and rear surface and including a nanopore having a nano-sized diameter; a reservoir disposed adjacent to a rear surface of the nanopore device; and a power supply unit comprising a first electrode disposed in a front of the nanopore device; a second electrode disposed inside the reservoir; and a third electrode disposed adjacent the nanopore and between the first electrode and the second electrode; as well as a method of using the biomolecule detection apparatus to detect a biomolecule in a sample.

Biomolecule detection apparatus including plurality of electrodes

Nanosensors including graphene and methods of manufacturing the same. A nanosensor includes a first insulating layer in which a first nanopore is formed; a graphene layer that is disposed on the first insulating layer and having a second nanopore or a nanogap formed therein adjacent to the first nanopore; and a marker element that is disposed adjacent to the graphene layer and identifies a position of the graphene layer.

Nanosensors including graphene and methods of manufacturing the same

A method of determining or estimating a nucleotide sequence of a nucleic acid by using a device with a nanopore.

Method of determining or estimating nucleotide sequence of nucleic acid

Provided is a device for determining a monomer molecule sequence of a polymer including different electrodes, and a method of efficiently determining a monomer molecule sequence of a polymer.

Device for determining a monomer molecule sequence of a polymer comprising different electrodes and use thereof

A nanopore device including a nanopore formed by penetrating a thin layer, a nanochannel formed at an entrance of the nanopore, and a filler in the nanochannel, as well as a method of fabricating the nanopore device and an apparatus including the nanopore device.

Nanopore device, method of fabricating the same, and DNA detection apparatus including the same

Provided are a method of manufacturing graphene, carbon nanotubes, fullerene, graphite, or a combination thereof having a regulated resistance, and a material manufactured using the method.

Method of manufacturing graphene, carbon nanotubes, fullerene, graphite or a combination thereof having a position specifically regulated resistance

A nanogap sensor includes a first layer in which a micropore is formed; a graphene sheet disposed on the first layer and including a nanoelectrode region in which a nanogap is formed, the nanogap aligned with the micropore; a first electrode formed on the grapheme sheet; and a second electrode formed on the graphene sheet, wherein the first electrode and the second electrode are connected to respective ends of the nanoelectrode region.

Nanogap sensor and method of manufacturing the same

Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an external terminal connection pad which is disposed at an opening and electrically connected to the redistributed line. The present general inventive concept can solve the problem where an ingredient of gold included in a redistributed line may be prevented from being diffused into an adjacent bump pad to form a void or an undesired intermetallic compound. In a chip on chip structure, a plurality of bumps of a lower chip are connected to an upper chip to improve reliability, diversity and functionality of the chip on chip structure.

Semiconductor packages and methods of manufacturing the same

A substrate for detecting samples includes; a body, and a plurality of micro lenses arranged on the body and configured for attachment to at least one sample, wherein the at least one sample emits fluorescent light, and wherein the plurality of micro lenses condense the fluorescent light emitted from the at least one sample via refraction.

Substrate for detecting samples, bio-chip employing the substrate, method of fabricating the substrate for detecting samples, and apparatus for detecting bio-material

A semiconductor module can include a printed circuit board (PCB) and a semiconductor package inserted into an inner space of the PCB. The semiconductor package may be electrically connected to the PCB. The PCB may thus surround the semiconductor package so that cracks may not be generated in the outer terminals.

Semiconductor module

A wafer level semiconductor module may include a module board and an IC chip set mounted on the module board. The IC chip set may include a plurality of IC chips having scribe lines areas between the adjacent IC chips. Each IC chip may have a semiconductor substrate having an active surface with a plurality of chip pads and a back surface. A passivation layer may be provided on the active surface of the semiconductor substrate of each IC chip and may having openings through which the chip pads may be exposed. Sealing portions may be formed in scribe line areas.

Wafer level semiconductor module and method for manufacturing the same

A package having an improved yield is provided. The package includes a support on which a plurality of biochips are disposed, and a cover bonded to the support and defining a reaction space for each of the plurality of biochips together with the support, the cover including at least one inlet/outlet.

Growing community of inventors

Seongnam-si, South Korea

Dong-ho Lee