Intel Corporation

Tahoe Research, Ltd.

Dong-Ho Han

Hyunjun Kim

Joong-Ho Kim

Jiangqi He

Hao-Han Hsu

Jaejin Lee

Chung-Hao Chen

Songnan Yang

Chin Lee Kuan

Amit Kumar Jain

Sameer Shekhar

Kevin Joseph Doran

Jerrod Peterson

Steven C Wachtman

Ryan K Kuhlmann

Kemal Aygun

Anand S Konanur

Nasser A Kurd

Ehud Reshef

Kaladhar Radhakrishnan

Je-Young Chang

Ido Ouzieli

Mark Charles Carbone

Stephen H Hall

Shantanu Dattatraya Kulkarni

Mohamed A Abdelmoneum

Denica N Larsen

Zhongsheng Wang

Kyle Jordan Arrington

Ana M Yepes

Kwan Ho Lee

Arik Gihon

Tomer Levy

Jun Liao

Yevgeni Sabin

Isaac A Simpson

Ping Sun

Konika Ganguly

Emile Davies-Venn

John Fallin

Jianggi He

Rashed Mahameed

Timothy M Swettlen

Amit Zeevi

Michael Shusterman

Mike Schaffer

Kirankumar Kamisetty

Cory Mason

Maor Tal

M Reza Zamani

Stephen Christianson

Arturo Navarro Alvarez

Jose Salazar Delgado

Joy Poddar

Qing De Xia

A device includes a processor that is configured to determine a band used for wireless communication by a baseband modem; select an operational frequency for a display controller based on the determined band; and control the display controller to operate at the selected operational frequency.

Display timing controller and method

Electromagnetic interference (EMI) shields having attenuation interfaces are disclosed. A disclosed example EMI shield includes side walls defining sides of the EMI shield, and an attenuation interface to be placed into contact with a circuit board. The attenuation interface includes an inner perimeter having an EMI absorber and an outer perimeter having a metal backing to at least partially surround the EMI absorber.

Electromagnetic interference shields having attentuation interfaces

An electronic computing device with a self-shielding antenna. An electronic computing device may include a frame, an antenna, and an antenna shielding. The frame includes a top cover and a bottom cover. Electronic components are included in a space formed between the top cover and the bottom cover. The antenna is for wireless transmission and reception and included in the frame near an edge of the frame. The antenna shielding is disposed around the antenna for providing electro-magnetic shielding from radio frequency (RE) noises generated from the electronic components included in the frame. The antenna shielding may be a metal wall disposed between the top cover and the bottom cover around the antenna. The frame may be a metallic frame and may include a cut-out in the top cover and the bottom cover above and below the antenna, and a non-metallic cover may be provided in the cut-out.

Electronic computing device having self-shielding antenna

A semiconductor package and a packaged electronic device are described. The semiconductor package has a foundation layer and a planar filtering circuit. The circuit is formed in the foundation layer to provide EMI/RFI mitigation. The circuit has one or more conductive traces that are patterned to form an equivalent circuit of inductors and capacitors. The one or more conductive traces include planar metal shapes, such as meanders, loops, inter-digital fingers, and patterned shapes, to reduce the z-height of the package. The packaged electronic device has a semiconductor die, a foundation layer, a motherboard, a package, and the circuit. The circuit removes undesirable interferences generated from the semiconductor die. The circuit has a z-height that is less than a z-height of solder balls used to attach the foundation layer to the motherboard. A method of forming a planar filtering circuit in a foundation layer is also described.

Package-level noise filtering for EMI RFI mitigation

Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate; a bridge, embedded in the package substrate, wherein the bridge includes an integral passive component, and wherein a surface of the bridge include first contacts in a first interconnect area and second contacts in a second interconnect area; a first die coupled to the passive component via the first contacts in the first interconnect area; and a second die coupled to the second contacts in the second interconnect area.

Embedded bridge substrate having an integral device

Methods and apparatus are disclosed to provide electrical shielding for integrated circuit packages using a thermal interface material. An integrated circuit package includes a substrate including a ground plane layer and a solder mask; a semiconductor die attached to the substrate, the solder mask layer separating the semiconductor die from the ground plane layer; and a thermal interface material surrounding at least a portion of the semiconductor die, the thermal interface material electrically coupled to the ground plane layer.

Methods and apparatus to provide electrical shielding for integrated circuit packages using a thermal interface material

A wireless communication device for communicating across a wireless communication channel includes one or more processors configured to determine whether a further device is generating a radio frequency interference at an operating frequency; transmit a request message to the further device requesting the further device vacate the operating frequency based on the determination that the further device is generating radio frequency interference; receive a response message from the further device; and generate an instruction based on the response message.

Methods and devices for dynamically avoiding radio frequency interference

Techniques for fabricating a package substrate and/or a stiffener for a semiconductor package are described. For one technique, a package substrate comprises: a routing layer comprising a dielectric layer. A stiffener may be above the routing layer and a conductive line may be on the routing layer, the conductive line comprising first and second portions, the first portion having a first width, the second portion having a second width, the conductive line extending from a first region of the routing layer to a second region of the routing layer, the first region being under the stiffener, the second region being outside the stiffener, the first portion being on the first region, and the second portion being on the second region. One or more portions of the conductive line can be perpendicular to an edge of the stiffener. The perpendicular portion(s) may comprise a transition between the first and second widths.

Stiffener and package substrate for a semiconductor package

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.

Radiation shield around a component on a substrate

Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer, a conductive layer formed in the foundation layer, and a magnetic layer formed between the conductive and the foundation layer. The conductive layer and the magnetic layer are coupled to form a low-profile inductor shield. The semiconductor package also has a dielectric layer formed between the magnetic and foundation layer. The foundation layer is mounted between a motherboard and a semiconductor die, where the foundation layer is attached to the motherboard with solder balls. Accordingly, the low-profile inductor shield may include a z-height that is less than a z-height of the solder balls. The low-profile inductor shield may have solder pads that are coupled to the conductive layer. The foundation layer may include at least one of voltage regulator and inductor, where the inductor is located above the low-profile inductor shield.

Ultra-low profile package shielding technique using magnetic and conductive layers for integrated switching voltage regulator

Embodiments herein disclose techniques for electronic apparatuses including a printed circuit board (PCB) and an electromagnetic interference (EMI) shield for the PCB. An electronic apparatus may include a PCB with a plurality of layers including a ground layer. The PCB may include a cutout through the plurality of layers of the PCB. An EMI shield may be mounted to a bottom side of the PCB along an edge of the cutout, where the EMI shield may be coupled to the ground layer through an ohmic contact. The EMI shield may be flat. Other embodiments may also be described and claimed.

Electromagnetic interference (EMI) shield for a printed circuit board (PCB)

Embodiments include apparatuses, methods, and systems including an electronic apparatus including an inductor within a circuit package affixed to a printed circuit board (PCB) having a ground layer, where the ground layer includes a mesh area that is substantially void along a contour of the inductor. An electronic apparatus may include a circuit package with an inductor, and a PCB, where the circuit package may be affixed to the PCB. The PCB may have a plurality of layers including a ground layer and a power layer, where the ground layer may be between the power layer and the inductor. The ground layer may include a mesh area that may be substantially void along a contour of the inductor within the circuit package. Other embodiments may also be described and claimed.

Ground layer design in a printed circuit board (PCB)

Electronic device packages utilizing a stiffener coupled to a substrate with a magnetic lossy bonding layer to attenuate or absorb electromagnetic signals such as radio frequency interference (RFI) along with related systems and method are disclosed.

Electronic device packages with attenuated electromagnetic interference signals

Growing community of inventors

Beaverton, OR, United States of America

Dong-Ho Han