Samsung Electronics Co., Ltd.

Dong-Gil Lee

Jung-Hwan Kim

Tae-Je Cho

Kyu-Dong Jung

Kwang-Chul Choi

Hyun-Uk Jung

Jin-Yeong Kim

Provided are an initiator and a method for debonding a wafer supporting system. The initiator for debonding a wafer supporting system includes a rotation chuck having an upper surface on which a wafer supporting system (WSS), which includes a carrier wafer, a device wafer, and a glue layer for bonding the carrier wafer and the device wafer to each other, is seated to rotate the wafer supporting system, a detecting module detecting a height and a thickness of the glue layer and a laser module generating a fracture portion on the glue layer through irradiating a side surface of the glue layer with a laser on the basis of the height and the thickness of the glue layer.

Initiator and method for debonding wafer supporting system

During a garbage collection process for a non-volatile memory device of a storage device, an adaptive copy-back method selectively performs either an external or an internal copy-back operation in view of certain performance conditions for a storage device. The external copy-back operation is performed when a number of error-corrected bits per unit size of read data exceeds a given threshold value, and the internal copy-back operation is performed when the number of error-corrected bits does not exceed the threshold value.

Adaptive copy-back method and storage device using same

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Seoul, South Korea

Dong-Gil Lee