Samsung Electronics Co., Ltd.

Dong-Eog Kim

Jin Cheol Shin

Seung-Hun Oh

Eun-Seok Lee

Nam-Hoon Lee

Young-Seok Jang

Woo-Mok Son

Jong-han Oh

Seung-hwang Yi

In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

Polishing apparatus including polishing pad conditioner, non-contact displacement sensor, and data processor

Method of manufacture including polishing pad monitoring method and polishing apparatus including polishing pad monitoring device

An apparatus to align a substrate and a print head having a plurality of orifices so as to perform a printing operation by ejecting ink on the substrate comprises a camera unit provided between the substrate and the print head to photograph the plurality of orifices of the print head and the substrate so as to align the print head and the substrate, and a camera moving part to movably support the camera unit and to move the camera unit between the substrate and the print head. Thus, the aligning apparatus has a simple configuration that may be easily installed and may be controlled precisely. The aligning apparatus may also be used with opaque substrates.

Aligning apparatus

Growing community of inventors

Suwon-si, South Korea

Dong-Eog Kim