Samsung Electronics Co., Ltd.

Dong-earn Kim

In-Taek Han

Yoon-chul Son

Sang-Eui Lee

Min-jong Bae

Ha-Jin Kim

Sung-hoon Park

Dong-ouk Kim

Kun-mo Chu

Ha-jin Kim

Sang-eui Lee

Sang-Soo Jee

Sang-soo Jee

Kun Mo Chu

Ha Jin Kim

Dong-Ouk Kim

A heating member for a fusing apparatus includes a resistive heating layer including a base polymer and an electroconductive filler dispersed in the base polymer, where the resistive heating layer generates heat by receiving electric energy, and where a storage modulus of the resistive heating layer is about 1.0 megapascal or greater.

Heating member and fusing apparatus including the same

A heating composite, including a polymer matrix; and a carbon nanotube structure including a plurality of carbon nanotubes continuously connected to each other and integrated with the polymer matrix.

Heating composite, and heating apparatus and fusing apparatus including the same

A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.

Resistance heating composition, heating composite using the composition, method of preparing the heating composite, and heating apparatus and fusing apparatus using the same

A resistance heating element includes a positive temperature coefficient resistance heating layer having a positive temperature coefficient, and a negative temperature coefficient resistance heating layer, which is connected to the positive temperature coefficient resistance heating layer and has a negative temperature coefficient.

Resistance heating element and heating member and fusing device employing the same

A heating member includes: a resistive heating layer which generates heat when supplied with electrical energy; a release layer as an outermost layer of the heating member and including a polymer; an intermediate layer disposed between the resistive heating layer and the release layer. The resistive heating layer includes a base polymer, and an electroconductive filler dispersed in the base polymer. The intermediate layer includes a polymer material being a same type as the base polymer of the resistive heating layer or the polymer of the release layer.

Heating member including a base polymer and fusing apparatus including the same

A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.

Method of forming thin resistive heating layer, heating member including the thin resistive heating layer, and fusing unit including the heating member

A heating member includes: a resistive heating layer including: a medium-passing area, and non-medium-passing areas respectively on opposing sides of the medium-passing area at opposing side portions of the resistive heating layer; a core which supports the resistive heating layer; a thermally conductive layer between the resistive heating layer and the core, and disposed in a non-medium passing area at a side portion of the resistive heating layer; and an electrode which is between the resistive heating layer and the core, contacts the side portion of the resistive heating layer and supplies current to the resistive heating layer. A ratio of a contact area between the thermally conductive layer and the resistive heating layer to an area of the non-medium-passing area in which the thermally conductive layer is disposed, ranges from about 5% to about 25%.

Heating member and fusing device including the same

A heating member includes a resistive heating layer disposed on an outermost layer of the heating member, where the resistive heating layer includes a conductive filler distributed in a base material and where the resistive heating layer emits heat when supplied with an electric current from an electrode, and a contacting unit which exposes the conductive filler of the resistive heating layer and contacts the electrode.

Heating member including resistive heating layer, and fusing apparatus and image forming apparatus including the heating member

A fusing device includes; a heating member having a resistive heating layer constituting an outermost portion of the heating member, a nip forming member facing the heating member to form a fusing nip therewith, and a plurality of current supplying electrodes which contact an outer circumference of the resistive heating layer to supply electrical current to the resistive heating layer.

Fusing device including resistive heating layer and image forming apparatus including the fusing device

A fixing unit includes a heating member which includes a core member, and a heating layer. The heating layer is disposed on an outer circumference of the core member. The heating layer includes an elastic material, and carbon nanotube doped with metal and distributed in the elastic material as a conductive filler of the heating layer. A press member faces the heating member to form a fixing nip. The fixing unit applies heat and pressure to toner on a medium passing through the fixing nip, to fix the toner on the medium.

Heating member using carbon nanotube and fixing unit using the heating member

A heating member includes a weight supporter having an outer circumference, and a resistive heating disposed on the outer circumference of the weight supporter. The resistive heating layer includes a conductive filler dispersed in a base material. A pair of electrodes extends along a length direction of a rotational axis of the weight supporter and is arranged along a circumference of the weight supporter for supplying electric power to the resistive heating layer.

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Seoul, South Korea

Dong-earn Kim