Samsung Electronics Co., Ltd.

Dong-chun Lee

Seong-Chan Han

Hyo-Jae Bang

Dong-Woo Shin

Byung-Man Kim

Kwang-Su Yu

Jung-Hyeon Kim

Young-Soo Lee

Heui-seog Kim

Yong-Hyun Kim

Chang-Yong Park

Kwang-Ho Chun

Kyung-du Kim

Jun-Young Lee

Chung-Sam Jun

Ho-Geon Song

Hyun-Seok Choi

Hyoung-jin Kim

Sang-mun Chon

Sun-kyu Hwang

Hyun-Jong Oh

Kwang-Seop Kim

Sang-bong Choi

Si-Suk Kim

Myung-Jong Eom

Sung-gon Ryu

A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through holes which are spaced apart from each other. The first and second fillings are buried in the first and second through holes, respectively, and formed of a reflowable conductive material. The first passive element includes first and second electrodes. A first insertion groove is formed in a portion of a surface of the board member between the first and second through holes and portions of the first and second fillings. The first passive element is mounted on the first insertion groove. The first electrode includes a bottom surface and a side contacting the first filling and an exposed upper surface. The second electrode comprises a bottom surface and a side contacting the second filling and an exposed upper surface.

Reworkable passive element embedded printed circuit board

Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.

Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly

A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.

Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module

A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

Semiconductor device and method of manufacturing the same

Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.

Semiconductor package having passive component and semiconductor memory module including the same

Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

Printed circuit board of semiconductor package and method for mounting semiconductor package using the same

A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the first chip package and the module board and a protector for applying pressure to the conductive element, the module board, and the first chip package and/or acting as a heat sink for the first chip package.

Semiconductor module with conductive element between chip packages

A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.

Heat spreader, semiconductor package module and memory module having the heat spreader

A method and arrangement for attaching labels to a plurality of semiconductor modules arranged on a double-sided substrate is described which may shorten a process stream in an effort to reduce equipment costs. An exemplary arrangement may include at least one label attaching unit configured to attach labels to a plurality of semiconductor modules mounted on one of a first surface and a second surface of the double-sided substrate, and may include at least one turner configured to turn over the double-sided substrate to expose one of the first surface and second surface to the label attaching unit.

Method and arrangement for attaching labels to semiconductor modules

In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

Semiconductor module and method of forming a semiconductor module

An open socket, into which a module can be inserted, may include: a body into which the module is insertable; a pin to contact an electrical connection member of the inserted module, the pin serving as at least a part of an electrical signal path to/from the module upon insertion thereof; an elastic biasing member to exert an elastic biasing force to cause the pin to contact the module; and at least one lower support to limit insertion depth as being a depth at which a lower portion of the inserted module comes to rest upon the at least one lower support; the body and the at least one lower support being constructed and arranged to provide a gap adjacent the at least one support, which leaves an area of the socket underlying the lower portion of the inserted module open to the outside.

Open socket

A method for correcting color variations on the surface of a wafer, a method for selectively detecting a defect from different patterns, and computer readable recording media for the same are provided. Color variations in images of different parts of a wafer can be corrected using the mean and standard deviation of grey level values for the pixels forming each of the different parts of the wafer. In addition, different threshold values are applied to metal interconnect patterns and spaces of the wafer so that a defect can be selectively detected from the different patterns. Thus, a bridge known as a fatal, or killing defect to a semiconductor device can be detected without also falsely detecting grains as fatal defects. Due to increased defect screening capacity of the methods, the defect detecting method can be further efficiently managed.

Growing community of inventors

Cheonan-si, South Korea

Dong-chun Lee