Samsung Electro-mechanics Co., Ltd.

Tiumbio Co., Ltd.

Dong-Chul Shin

Jae-Sun Kim

Hyun-Jung Lee

Ju Young Lee

Bong-Yong Lee

Hun-Taek Kim

Je Ho Ryu

Keun-Ho Ryu

Jong-Guk Kim

Jaeseung Ahn

Sang-hwan Kang

Sung-Jun Park

Sim-Hwan Park

Yong-Hyuk Kim

Euisun Park

Young Ah Shin

Myung-Gun Chong

Chang-Jae Lee

Seon-Hye Kim

Joong-Mo Hwang

Hoechul Jung

Chul-Min Lee

Tae-Wook Jung

A manufacturing method for a printed circuit board includes: transferring roughness of a metal film to an insulating layer by laminating the metal film on the insulating layer, the metal film having the roughness formed on one surface thereof and having a discrete metal layer laminated thereon; exposing a surface of the insulating layer, on which the roughness is transferred, by removing the metal film; processing the surface of the insulating layer having the roughness formed thereon with an acidic solution; and forming a circuit pattern on the insulating layer by a plating process.

Manufacturing method for printed circuit board

The present invention provides a novel 2-pyridyl substituted imidazole derivative, or a pharmaceutically acceptable salt or solvate thereof, which selectively inhibits the transforming growth factor-&#x3b2; (TGF-&#x3b2;) type I receptor (ALK5) and/or the activin type I receptor (ALK4); a pharmaceutical composition comprising same as an active ingredient; and a use of the 2-pyridyl substituted imidazole derivative for the manufacture of a medicament for preventing or treating a disease mediated by ALK5 and/or ALK4 receptors in a mammal.

2-pyridyl substituted imidazoles as ALK5 and/or ALK4 inhibitors

Growing community of inventors

Suwon-si, South Korea

Dong-Chul Shin