Samsung Electronics Co., Ltd.

Dong-Chul Han

Dong-Soo Lee

Jeong-Hoon Kim

Sang-Geun Kim

Seok Goh

Ho-Soo Jang

A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.

Stacked package including spacers and method of manufacturing the same

A clamping apparatus capable of clamping various semiconductor substrates is provided. The clamping apparatus includes includes a main body, and a support plate partially coupled to the main body. The support plate is movable vertically. In addition, the clamping apparatus further includes a fixed gripper coupled and fixed onto the main body and a movable gripper disposed on the main body. The movable gripper is movable horizontally.

Growing community of inventors

Cheonan-si, South Korea

Dong-Chul Han