Lg Display Co., Ltd.

Ls Cable Ltd.

Dong-Cheon Shin

Kum-Mi Oh

Seok-Woo Lee

Han-Seok Lee

In-Hyuk Song

Young-Ki Jung

Won-Keun Park

Joon-Mo Seo

Tae-Hyun Sung

Byoung-Un Kang

Kyung-Tae Wi

Jai-Hoon Kim

A method of manufacturing an array substrate for a fringe field switching mode liquid crystal display includes: forming an auxiliary insulating layer on a second passivation layer and having a first thickness; forming first and second photoresist patterns on the auxiliary insulating layer and having second and third thicknesses, respectively, the second thickness greater than the third thickness; etching the auxiliary insulating layer, the second passivation layer and a first passivation layer to form a drain contact hole; performing an ashing to remove the second photoresist pattern and expose the auxiliary insulating layer therebelow; performing a dry etching to remove the auxiliary insulating layer not covered by the first photoresist pattern and expose the first passivation layer and to form an insulating pattern below the first photoresist pattern, the insulating pattern and the first photoresist pattern forming an undercut shape; forming a transparent conductive material layer having a fourth thickness less than the first thickness; and performing a lift-off process to remove the first photoresist pattern and the transparent conductive material layer thereon together and form a pixel electrode as a remaining portion of the transparent conductive material layer.

Array substrate for fringe field switching mode liquid crystal display and method of manufacturing the same

A method of fabricating an alignment layer for a liquid crystal display device includes forming an alignment material layer on a substrate by coating an alignment material, irradiating UV rays onto the alignment material layer and pre-baking the alignment material layer; and post-baking the alignment material layer.

Method of fabricating alignment layer for liquid crystal display device

A method of manufacturing an array substrate for a fringe field switching mode liquid crystal display includes: forming an auxiliary insulating layer having a first thickness; forming first and second photoresist patterns on the auxiliary insulating layer; performing an ashing to remove the second photoresist pattern and expose the auxiliary insulating layer therebelow; performing a dry etching to remove the auxiliary insulating layer not covered by the first photoresist pattern and expose a first passivation layer and to form an insulating pattern below the first photoresist pattern, the insulating pattern and the first photoresist pattern forming an undercut shape; forming a transparent conductive material layer having a fourth thickness less than the first thickness; and performing a lift-off process to remove the first photoresist pattern and the transparent conductive material layer thereon together and form a pixel electrode.

A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.

Dicing die adhesive film for semiconductor

Growing community of inventors

Seoul, South Korea

Dong-Cheon Shin