Samsung Electronics Co., Ltd.

Dong-Bin Kim

Sang-Woo Lee

Sung-Hee Lee

Tae-Hyun Kim

Byeong-Soo Kim

Young-Kyun Sun

Kook-Jin Oh

Youn-sung Ko

Joung-Min Oh

Dae-Soo Kim

A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.

Wire bonding apparatus and method for clamping a wire

A wafer sawing apparatus comprises an electrically conductive chuck table surrounding a suction plate and tactile sensing lines formed on the upper surface of the suction plate. At least one end of each tactile sensing line is electrically connected to the table body. A controller controls the chuck table and a scribing blade. The controller is electrically connected to both elements. The controller comprises a tactile sensing unit connected to the table body for sensing contact of the scribing blade with the tactile sensing lines or the table body and an equipment stop unit for stopping the scribing blade. The controller further comprises a zero point adjusting unit for receiving a contact signal from the tactile sensing unit and for adjusting a zero point of the scribing blade, and a switching unit connecting the tactile sensing unit to the zero point adjusting unit or the equipment stop unit.

Wafer sawing apparatus

Growing community of inventors

Cheonan-si, South Korea

Dong-Bin Kim