Qualcomm Incorporated

Qualcomm Mems Technologies, Inc.

Donald William Kidwell, Jr

Ravindra Vaman Shenoy

Jon Lasiter

Kwan-Yu Lai

Mario Francisco Velez

Mohammad Ali Tassoudji

Jitae Kim

Evgeni Petrovich Gousev

Jonghae Kim

Changhan Hobie Yun

Daeik Daniel Kim

Edwin Chongwoo Park

Chengjie Zuo

Russell Wayne Gruhlke

Vladimir Aparin

Jeremy Darren Dunworth

Seong Heon Jeong

Mete Erturk

Khurshid Syed Alam

Ravishankar Sivalingam

Hrishikesh Vijaykumar Panchawagh

Suryaprakash Ganti

Arnold Jason Gum

Kostadin Dimitrov Djordjev

David William Burns

Hao-Yen Tang

Omar James Bchir

Yipeng Lu

Chin-Kwan Kim

Philip Jason Stephanou

Alan G Lewis

Timothy Dickinson

Yu-Chin Ou

Alireza Mohammadian

Rohit Sauhta

Kebin Li

James Thomas Doyle

Ana Rangelova Londergan

Sidney Sitachitt

Layal Rouhana

Elbert McLaren

Victor Louis Arockiaraj Pushparaj

Christopher Feuling Ferguson

Systems, methods, and non-transitory media are provided for low-power visual tracking systems. An example method can include receiving one or more images captured by each image sensor system from a set of image sensor systems on a first device, the one or more images capturing a set of patterns on a second device, wherein the first device has lower power requirements than the second device, the set of patterns having a predetermined configuration on the second device; determining, from the one or more images captured by each image sensor system, a set of pixels corresponding to the set of patterns on the second device; determining, based on the set of pixels corresponding to the set of patterns, a location and relative pose in space of each pattern; and determining, based on the location and relative pose of each pattern, a pose of the first device relative to the second device.

Low power visual tracking systems

Various aspects of the present disclosure generally relate to optical character detection. In some aspects, a user device may receive, from a vision sensor, a first image that is associated with a first optical character image. The user device may determine, using an image processing model, that the first image depicts the first optical character image. The user device may cause, based at least in part on determining that the first image depicts the first optical character image, a camera to capture a second image that is associated with a second optical character image. The user device may perform an action associated with the second image. Numerous other aspects are provided.

Optical character detection using a low-power sensor

An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.

Broadband antenna system

A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.

Hearable device comprising integrated device and wireless functionality

Some aspects pertain to an inductor apparatus that includes a first metal layer including a plurality of first interconnects, a second metal including a plurality of second interconnects, a first dielectric layer between the first metal layer and the second metal layer, and an inductor. The inductor includes a plurality of vias, where the plurality of vias are configured to couple the plurality of first interconnects to the plurality of second interconnects. The inductor includes a plurality of inductor loops formed by the plurality of vias, the plurality of first interconnects and the plurality of second interconnects. The inductor further includes a first magnetic layer and a second magnetic layer, located between the first interconnects and the second interconnects; and a third magnetic layer and an optional fourth magnetic layer outside of the plurality of inductor loops.

Inductor apparatus and method of fabricating

Techniques and structures are provided for manufacturing a flexible PMUT array. In one embodiment, a piezoelectric micromechanical ultrasonic transducer (PMUTs) array comprises a plurality of PMUTs, where each PMUT in the flexible array of PMUTs includes: a first polymer layer configured to support the PMUT, a mechanical layer configured to provide planarization to the PMUT, a first electrode, a second electrode, a piezoelectric layer configured to separate the first electrode and the second electrode, patterns on the first electrode, the piezoelectric material, and the second electrode configured to route electrical signals, and a cavity configured to adjust a frequency response of the PMUT.

Manufacturing method for flexible PMUT array

In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.

High aspect ratio interconnects in air gap of antenna package

Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.

Release hole plus contact via for fine pitch ultrasound transducer integration

An package and related methods are disclosed. The package may include an antenna, an insert made of low-loss material, and a mold, wherein the mold directly contacts and surrounds at least a portion of the insert, wherein the antenna is formed of conductive material disposed at least in part on a surface of the insert.

Antenna-on-package arrangements

An apparatus may include one or more segmented piezoelectric micromechanical ultrasonic transducer (PMUT) elements. Each segmented PMUT element may include a substrate, an anchor structure disposed on the substrate and a membrane disposed proximate the anchor structure. The membrane may include a piezoelectric layer stack and a mechanical layer. The anchor structure may include boundary portions that divide the segmented PMUT element into segments. Each segment may have a corresponding segment cavity. The boundary portions may correspond to nodal lines of the entire membrane. The membrane may include a membrane segment disposed proximate each segment cavity. The membrane may be configured to undergo one or both of flexural motion and vibration when the segmented PMUT element receives or transmits signals.

Piezoelectric micromechanical ultrasonic transducers and transducer arrays

An ultrasonic sensor pixel includes a substrate, a piezoelectric micromechanical ultrasonic transducer (PMUT) and a sensor pixel circuit. The PMUT includes a piezoelectric layer stack including a piezoelectric layer disposed over a cavity, the cavity being disposed between the piezoelectric layer stack and the substrate, a reference electrode disposed between the piezoelectric layer and the cavity, and one or both of a receive electrode and a transmit electrode disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The sensor pixel circuit is electrically coupled with one or more of the reference electrode, the receive electrode and the transmit electrode and the PMUT and the sensor pixel circuit are integrated with the sensor pixel circuit on the substrate.

Integrated piezoelectric micromechanical ultrasonic transducer pixel and array

The disclosure relates to a glass-based antenna array package. In an aspect, such a glass-based antenna array package includes a single glass substrate layer, one or more antennas attached to a first side of the glass substrate layer, at least one semiconductor device attached to a second side of the glass substrate layer, and a first photoimageable dielectric layer adhered to the second side of the glass substrate layer and encapsulating the at least one semiconductor device. A method of manufacturing the same is also disclosed.

Glass-based antenna array package

An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.

Embedded thin film magnetic carrier for integrated voltage regulator

Embodiments of a sensor device and methods for manufacturing the same are disclosed. In one embodiment, a sensor device comprises a piezoelectric micromechanical ultrasonic transducer (PMUT) array configured to transmit and receive ultrasonic signals, where the PMUT array comprises a plurality of PMUTs and the PMUT array is flexible, one or more integrated circuits configured to process the ultrasonic signals, a battery configured to provide power to the PMUT array and the one or more integrated circuits, a coupling material configured to hold the PMUT array, the one or more integrated circuits, and the battery, and a capsule configured to seal the PMUT array, the one or more integrated circuits, the battery and the coupling material within the capsule.

Sensor device

Provided are space-efficient capacitors that have a higher quality factor than conventional designs and improve coupling of electrical energy from a through-glass via (TGV) to a dielectric. For example, provided is a TGV having a non-rectangular cross-section, where one end of the TGV is coupled to a first metal plate. A dielectric material is formed on the first metal plate. A second metal plate is formed on the dielectric material in a manner that overlaps at least a portion of the first metal plate to form at least one overlapped region of the dielectric material. At least a part of the perimeter of the overlapped region is non-planar. The overlapped region can be formed in a shape of a closed ring, in a plurality of portions of a ring shape, in substantially a quarter of a ring shape, and/or in substantially a half of a ring shape.

High quality factor capacitors and methods for fabricating high quality factor capacitors

Growing community of inventors

Los Gatos, CA, United States of America

Donald William Kidwell, Jr