International Business Machines Corporation

Donald W Diangelo

Michael E Cropp

John Ulrich Knickerbocker

Krishna Gandhi Sachdev

Glenn A Pomerantz

Candace A Sullivan

James C Utter

Daniel S Mackin

John F Harmuth

Bruce E Tripp

David E Speed

Govindarajan Natarajan

Mark J LaPlante

Hsichang Liu

Renee L Weisman

Jay A Bunt

Thomas A Kline

Cristian Docu

Thomas Foley

Melvin R Gottschalk, Jr

Lisa A Hamilton

Sebastian Loscerbo

Olga A Otieno

David Clifford Long

Jon Alfred Casey

James N Humenik

Robert J Sullivan

John T Butler

Kamalesh S Desai

Thomas A McPhee

James T Taylor

Alberto H Gay

Clifford T Rogers

Carmella Pemberton

Joseph Saltarelli

Nicholas L Volkringer

John J DeMarco

An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers

Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers

The present invention provides a method for controlling production or manufacturing costs by obtaining yield measurements of unit manufacturing for a multiplicity of products or production lines having a plurality of processes which includes determining a started units number for the plurality of processes. The method further includes determining a cost per unit for each unit of the plurality of processes, and calculating an expected approved units number for the plurality of processes. The expected approved units number is calculated by multiplying the started units number by an expected yield measurement. The method next includes calculating an actual approved units number for each of the plurality of processes by multiplying the started units number by an actual yield measurement, and calculating an unapproved units number for each of the plurality of processes by subtracting the expected approved units number from the actual approved units number. The method then includes calculating cost of yield measurements for the plurality of processes by multiplying the unapproved units number by the cost per unit, and providing a comparison of the cost of yield measurements for the plurality of processes.

Method of improving production through cost of yield measurement

This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.

Aqueous quaternary ammonium hydroxide as a screening mask cleaner

A cleaning method and related apparatus for cleaning semiconductor screening masks using an aqueous alkali detergent solution applied under high pressure simultaneously from both sides of the mask, followed by a drying step that uses air knives to blow off the mask surface any residual cleaner solution.

System for cleaning residual paste from a mask

Optimized in-line mask cleaning system

A semiconductor ceramic packaging substrate has the usual vias of sintered electrically conductive metal extending through the substrate. There are the usual metal conductor lines comprising conductive elements on the surface of the substrate. Each via is connected to the conductive elements in a predetermined pattern through a conductive via cap on the surface of the ceramic package. The caps join each conductive element and each via. The cap has a width substantially larger than the diameter of the via at the point of contact of the via and the conductive element in contact with it. The caps are also substantially thicker and wider than the conductive elements.

MLC conductor pattern off-set design to eliminate line to via cracking

In the fabrication of a circuit device including a substrate for providing connections between connection pins to be bonded to I/O pads on one side of the substrate and chips to be bonded to pads on the other side of the substrate, bonding is achieved simultaneously on both sides of the substrate by using a pin holder on an upper side of the substrate and using the surface tension of a flux to adhere and finely position the chips on the lower side of the substrate. The same or a modified technique may be used for the replacement of chips during repair of the circuit device. Repair of damaged or defective pin bonds yields a bond which is structurally and electrically improved in comparison with the originally formed bond.

Low cost pin and tab assembly for ceramic and glass substrates

Growing community of inventors

Fishkill, NY, United States of America

Donald W Diangelo