International Business Machines Corporation

International Business Corporation

Donald Seton Farquhar

Konstantinos I Papathomas

Michael Joseph Klodowski

Mark David Poliks

Voya Rista Markovich

Robert Maynard Japp

Brian Eugene Curcio

Lisa Jeanine Jimarez

James Robert Wilcox

Christina Marie Boyko

Douglas Oliver Powell

Andrew Michael Seman

Bernd Karl-Heinz Appelt

Elizabeth F Foster

James Russell Bupp

Frank Daniel Egitto

Ross William Keesler

Gary Lee Schild

John M Lauffer

David Brian Stone

David L Questad

Kostas I Papathomas

Jeffrey Alan Zimmerman

Mario Leonardo Cesana

Keith P Brodock

Leonard L Schmidt

William Louis Brodsky

Jane M Shaw

Claudius Feger

John Steven Kresge

Natalie Barbara Feilchenfeld

Gerald Walter Jones

Robert David Sebesta

Kostantinos I Papathomas

Edmond Otto Fey

Francis Joseph Downes, Jr

Stephen Joseph Fuerniss

James D Herard

Steve Harris Weingart

Der-jin Woan

Martino Taddei

George Szeparowycz

Roy Rongqing Yu

Sung Kwon Kang

Fulvio Vittorio Fontana

Chandrika Prasad

William John Rudik

Randall Joseph Stutzman

David Erle Houser

Charles Robert Davis

Amit Kumar Sarkhel

Raymond Thomas Galasco

Paul George Rickerl

Michael Wozniak

Varaprasad Venkata Calmidi

Gregory A Kevern

Darbha Suryanarayana

Gerald Paul Kohut

Giuseppe Butturini

Gerard Paul Kohut

Frank J Downes, Jr

Chris M Boyko

Richard J Supa

A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.

Multi-layered interconnect structure using liquid crystalline polymer dielectric

A security enclosure and method of forming the security enclosure. The security enclosure includes an electronic assembly, an extension, and a tamper respondent wrap. The extension has a first end inserted in the assembly and a second end having at least one bonding pad thereon. The tamper respondent wrap at least partially surrounds the assembly. The wrap has a bonding pad. The bonding pad of the extension is secured to the bonding pad of the wrap. The tamper respondent wrap includes a plurality of layers. A plurality of electrically conductive lines or a plurality of electrically conductive ink traces exist within each layer of the wrap.

Security cloth design and assembly

A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.

Method and structure for producing Z-axis interconnection assembly of printed wiring board elements

An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature Tand a maximum temperature T. Tconstrains the ductility of the first dielectric layer to be at least Dfollowing the laminating. Tdepends on Dand on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature Tand a maximum temperature T. Tconstrains the ductility of the second dielectric layer to be at least Dfollowing the laminating. Tdepends on Dand on a second dielectric material comprised by the second dielectric layer.

Electronic package with optimized lamination process

A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.

Method for producing Z-axis interconnection assembly of printed wiring board elements

A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of applying a continuous homogenous metal layer onto a dielectric substrate, applying a first photoresist and exposing and developing said first photoresist to define a pattern of conductive bumps, etching the metal layer exposed by said development to form said plurality of conductive bumps, removing said first photoresist, applying a second photoresist onto the metal layer, exposing and developing said second photoresist to define a pattern of conductive bumps and circuit lines; etching the metal layer exposed by said development to form a pattern of circuit lines in said metal layer; and removing said second photoresist. The methods of the present invention also provides for fabricating a multilayer circuit board and a metallic border for providing rigidity to a panel.

Manufacturing methods for printed circuit boards

A multilayered stack and method of formation. First and second dielectric layers are formed, respectively including first and second liquid crystal polymer (LCP) dielectric materials, with an electrically conductive plug through the first dielectric layer. A first and second electrical circuitization is formed in direct mechanical contact with a surface of the first and second dielectric layer, respectively, wherein the second electrical circuitization mechanically and electrically contacts an end of the plug, and wherein the plug is fluxlessly soldered to the first electrical circuitization. The first and second dielectric layers and the first electrical circuitization are subjected to a temperature below the lowest nematic-to-isotropic transition temperature of the first and second LCP dielectric materials, for a dwell time and elevated pressure sufficient to cause the first and second LCP dielectric materials to directly bond the second dielectric layer to the first dielectric layer and to the first electrical circuitization.

Z-interconnections with liquid crystal polymer dielectric films

The present invention relates to a method for providing an interconnect between layers of a multilayer circuit board. A first via extending through a total thickness of a first layer is formed. The first via is totally filled with a first solid conductive plug and an end of the first solid conductive plug includes a first contact pad that is in contact with a surface of the first layer. A second via extending through a total thickness of a second layer is formed. The second via totally filling with a second solid conductive plug and an end of the second solid conductive plug includes a second contact pad that is in contact with a surface of the second layer. The second layer is electrically and mechanically coupled to the first layer by an electrically conductive adhesive that is in electrical and mechanical contact with both the end of the first plug and the end of the second plug.

Solid via layer to layer interconnect

The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.

Enhanced design and process for a conductive adhesive

A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material.

Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same

A method and apparatus for forming a security enclosure having improved fold retention. In particular, the enclosure is formed by folding a flexible tamper respondent cloth around an electronic assembly. An adhesive on the inner folded surfaces of the cloth temporarily retains the folds. The enclosure is then exposed to heat and pressure to promote improved adhesion strength of the adhesive, thereby improving fold retention.

Method and apparatus for improved fold retention on a security enclosure

A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole is formed through the substrate. The through hole passes through nonplatable dielectric material within the dielectric layer. As a result, subsequent seeding and electroplating of the through hole results in a conductive metal plating forming at a wall of the through hole on a segment of the first laminate layer and on a segment of the second laminate layer, but not on the nonplatable dielectric material of the dielectric layer. Thus, the conductive metal plating is not continuous from the first laminate layer to the second laminate layer.

Formation of multisegmented plated through holes

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Endicott, NY, United States of America

Donald Seton Farquhar