International Business Machines Corporation

Globalfoundries Inc.

Donald R Letourneau

Jeffrey P Gambino

Anthony K Stamper

Timothy Harrison Daubenspeck

Thomas L McDevitt

Felix Patrick Anderson

Timothy S Hayes

Shawn A Adderly

Prakash Periasamy

John M Sutton

Samantha D DiStefano

Patrick S Spinney

Leah J Bagley

The disclosure relates to semiconductor structures and, more particularly, to waveguide structures used in phonotics chip packaging and methods of manufacture. The structure includes: a first die comprising photonics functions including a waveguide structure; a second die bonded to the first die and comprising CMOS logic functions; and an optical fiber optically coupled to the waveguide structure and positioned within a cavity formed in the second die.

Waveguide structures used in phonotics chip packaging

The present disclosure relates to semiconductor structures and, more particularly, to wire bond pad structures and methods of manufacture. The structure includes: bond pads in an active region of a chip; test pad structures in a kerf region of the chip; and hardmask material in the kerf region between the test pad structures and the bond pads. The surfaces of the test pad structures and the bond pads are devoid of the hardmask material.

Wiring bond pad structures

A semiconductor fuse device and a method of fabricating the fuse device including a last metal interconnect layer including at least two discrete metal conductors, an inter-level dielectric layer deposited over the last metal interconnect layer and the at least two discrete metal conductors, a thin wire aluminum fuse connecting the at least two discrete metal conductors, and a fuse opening above the aluminum fuse.

System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme

System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme

Growing community of inventors

Winooski, VT, United States of America

Donald R Letourneau