Texas Instruments Corporation

Other

Donald R Kelley

Jerry B Medders

Jeffrey L Popken

Susan S Fitzgerald

Shafidul Islam

James A Kennon

Philip A Burr

A tool is provided for notching an end of a pipe. A punch is provided with a first cutting edge opposite a second cutting edge. The punch is coupled to a punch holder which is configured to move vertically relative to a collar supported upon a base. A pipe support provides a preferred form of die to hold the pipe adjacent the punch. The pipe support includes a first edge, second edge, third edge and fourth edge which can be selectively presented for supporting the end of the pipe adjacent the punch. The first cutting edge and second cutting edge of the punch can be selectively provided for cutting the notch in the pipe. The punch and pipe support are preferably both re-orientable to select various different edges for supporting and cutting the pipe.

Pipe notcher

A lead frame assembly is disclosed which interfaces with existing wire bonders using a single track design from the bonder through the molding process. During the molding operation, the bonded lead frame is transferred into the mold on a guide track system built into the mold chase. The mold closes and clamps the lead frame after which a compound charging system meters and injects a compound into the mold cavities. The mold is opened and the strip ejected and transferred out of the mold via internal guide tracks. A granular or pellet form of compound is used in the charging system. The lead frame assembly has side rails, between which a temporary and a permanent support structure is formed. The temporary support structure is removed from the bonded integrated circuits after the bonding process is completed, while the permanent structure is made a part of the bonded integrated circuit package. A portion of the temporary support structure has a hole through it, which allows the bonding compound to pass through the lead frame to enable encapsulation of the integrated circuit both above and below the lead frame in the bonding cavity.

Lead frame assembly for an integrated circuit molding system

A molding system and process is disclosed to interface with existing wire bonders using a single track design from the bonder through the molding process. During the molding operation, the bonded lead frame is transferred into the mold on a guide track system built into the mold chase. The mold closes and clamps the lead frame after which a compound charging system meters and injects a compound into the mold cavities. The mold is opened and the strip ejected and transferred out of the mold via internal guide tracks. A granular or pellet form of compound is use in the charging system.

New IC molding process

Growing community of inventors

Sherman, TX, United States of America

Donald R Kelley