Agilent Technologies, Inc.

Donald M Logelin

Brent Anthony Holcombe

Brock J LaMeres

Robert H Wardwell

Bob J Self

Glenn Wood

A probe apparatus has first and second access ports and a measurement port. The first and second access ports are adapted to be interposed in a test circuit. A voltage amplifier and a voltage splitter are adapted to present the second access port and the measurement port each with a voltage representative of a voltage received by the first access port.

Regenerator probe

Uncontrolled characteristic impedance along a spring biased pin probe assembly is avoided by providing a stepped shelf of ground plane that extends outward along the pin and toward the target signal. The length of outward extension is chosen such that even when there is only (or at least) an expected minimum amount of compression of the spring while producing and maintaining contact, the entire exposed portion of the pin is over the shelf, whose depth of step has been selected to produce a selected Zfor the exposed pin that matches Zfor existing transmission lines already within the probe assembly. The spring biased pin may be a resistor tip spring pin that includes a small resistor in its tip.

Probe assembly with controlled impedance spring pin or resistor tip spring pin contacts

An interconnect formed using a stiff layer having a plurality of holes extending there through. A first flexible layer is bonded to a first side of the stiff layer. The first flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. A second flexible layer is bonded to a second side of the stiff layer. The second flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. Signal paths are formed in the holes, the signal paths connecting the plurality of conductive bumps on the first layer to the plurality of conductive bumps on the second layer.

High density interconnect

A probe that connects test and measurement equipment to a device under test via a plurality of cables. The probe is formed of a plurality of printed circuit boards that are stacked together. Each board is connected to one of the plurality of cables and has a longitudinal set of pads along an edge electrically connected to the cable. The stacked plurality of printed circuit boards form a two dimensional array of pads for connecting to a similar set of pads on a device under test.

Growing community of inventors

Colorado Springs, CO, United States of America

Donald M Logelin