Western Electric Company, Inc.

At&t Technologies, Inc.

Donald M Large

Kristen E Bankes

Anderson F Johnson, Jr

Joseph A Tamashasky

Fred J Reinhard

Richard K Beltz

Carl H Herman

Michael K Avedissian

Daniel D Leffel

Anthony J Schorr

Components such as lids (9) and electronic chip carriers (10) are assembled by registering respective mating faces of each component. An array of assembly stations (75) are formed on an upwardly extending edge (67) of a base (66) having a special inclination. For example, a lid (9) is supported with its mating face upturned and a carrier (10) is supported with its mating face downturned upon the upturned face of the lid (9) on the base (66). The inclination causes the components to slide relative to each other and the base in a given direction within each station (75). A plate (92) overlies a plate (72), supported on and inclined with the base (66). Plate (72) has an opening (74) and plate (92) has an overlying opening (94) to each station (75). The openings (74) and (94) have respective reference edges for stopping sliding of, and thereby positioning an upturned lid (9) and a downturned carrier ( 10) thereupon with a desired registration. A shuttle mechanism (80) reciprocates plate (72) with the openings (74) to and from a magazine (78) to guidably deliver an inverted lid (9) into each station (75). Another magazine (90) is moved to and inclined with the base (66) and guidably delivers an inverted carrier (10) on top of each lid (9) in each station (75). Magazine (90) is moved away and a group clamp (125) is utilized to grasp a resulting array of assembled components for transfer to a subsequent operation.

Assembling components having mating faces

An article such as a semiconductor wafer (10) is cut by splitting along a line (22) in a plane known to facilitate splitting. Wafer (10) is supported in a laterally unrestrained manner in a holder (34) lined with preferred paper (26) and fitted with a reference plate (43). Paper liner (26) is of a type having a surface (25) capable of developing lateral restraint by friction between such surface (25) and a surface (13) of wafer (10). A resilient force is applied normal to and upon a top surface (11) of wafer (10) by a press (60) having members (75 and 76) applied along line (22). Separation stresses develop along line (22) of the splitting plane and friction forces develop along paper surface (25) providing lateral resistance to an expected cutting force. A cutter (80) has an elongate tool (92) which is advanced at a top edge (27) of wafer (10) where it abuts plate (43). Tool (92) has a leading edge (94) for cutting and lateral faces (95 and 96) converging angularly toward edge (94) for separating cut surfaces. Tool (92) is advanced into and along the splitting plane at a preferred angle of about forty-five degrees between wafer surface (11) and elongate portion (93) of tool (92). Utilizing a micrometer assisted assembly (86), a gradual, calibrated force is applied to advance tool (92) for a precise distance into wafer (10). Tool (92) provides sufficient cutting and separation that a split becomes self-propagating along line (22) through wafer (10).

Cutting articles along known planes

Articles such as miniature laser chips (15) are individually removed from an array on an adhesive web (20). A subjacent forming die has a planar, central surface (160) containing a vacuum cavity (120) and peripheral sloping surfaces (162). The web (20) has an adhesive side for holding the chips (15) and a smooth side for conforming to surfaces (160) and (162) of die (116). A leading target chip (15) is located centrally of cavity (120) on a planar portion of web (20) which portion is substantially restrained from movement away from die (116) by vacuum drawn in cavity (120). At the smooth side of web (20), within cavity (120), there is a needle (135) which is movable perpendicularly of and through web (20) along a path containing the target chip (15). At the adhesive side of web (20), opposite needle (135), there is a pickup probe (147) having a vacuum port (166 ) to retain a chip (15). Also, probe (147) is movable relative to and with a target chip (15) and the needle (135). Conveniently, probe (147) is registered with and forces a chip (15) into web (20) to reflect light and confirm contact. Then subjacent needle (135) is advanced to contact the same chip (15) from the smooth side of web (20). In synchronization, the probe (147) and needle (135) are then moved, with the chip (15) held therebetween, at least until the chip (15) is separated from web (20).

Removing articles from an adhesive web

Wafers (12), including those in the solid state electronics industry, are demounted from an adherent surface (79). A respective passageway (90) is extended from a fluid supply device (92), through the adherent surface (79) to and in communication with, the mounting surface (16) of a respective wafer (12). The fluid is applied via the passageway (90) to and between the mounting surface (16) of the wafer (12) and the adherent surface (79) with sufficient pressure to dislodge the wafer (12). In an advantageous embodiment, the passageway (90) extends to a location between about the centerline (98) and the periphery of the wafer (12). The fluid is thereby applied in an off-center manner with leveraged force to break the seal between the adherent surface (79) and the wafer (12).

Method and apparatus for demounting wafers

Magnetic articles (10) are advanced in single file within a tube (14) for dispensing therefrom. A first magnetic device (20) establishes a magnetic field to releasably seize the leading article (10) such that trailing articles (10) are stopped in the tube (14). A second magnetic device (22) operates at a fixed location along the tube (14) and establishes a magnetic field to releasably seize the next trailing article (10) in the tube (14). A mechanism (40) then indexes the device (20) with the seized, leading article (10) a sufficient distance away from attraction of the second device (20) such that, when the leading article (10) is released by device (20), it is also released from tube (14).

Dispensing magnetic articles

An off-line system for handling elongated magnetic articles such as axially leaded diodes 12 includes a magnetic receiving chute 20, a blocking mechanism 45, a magnetic loading station 75 for supporting at least one tray 55 and for loading diodes 12 therein, and a drive train 115. The chute 20 receives the diodes 12 and guides such diodes downwardly to an outlet 24 and the tray 55. Over a major accessible face of the tray 55 a cover 63 is slidably removable from a second end 60. At the loading station 75, the tray 55 is disposed in an upright manner resting on the second end 60 at a first elevation with a first end 59 extending at least to the outlet 24 of chute 20. An elevating mechanism 80 applied to the end 60 elevates tray 55 to a second elevation, while the cover 63 remains at about the first elevation. A portion of tray 55 is thereby opened adjacent the first end 59 which opening abuts to and registers with the outlet 24 of chute 20. The blocking mechanism 45 has stored diodes 12 in chute 20 while a tray 55 has been changed and mechanism 45 now releases the diodes 12 which are introduced into tray 55. Loading station 75 includes magnetic assemblies 100 and 108 which maintain orientation of the diodes 12 as they are loaded into a tray 55. When a machine count indicates that tray 55 is loaded, the mechanism 45 blocks further advancement of diodes 12 in chute 20. A ram mechanism 95 pushes the tray 55 downwardly to the first elevation while the cover 63 is slidably closed therealong. In a computer controlled operation, the drive train 115 advances the loaded tray 55 away from and an empty tray 55 into the loading station 75 to continue the loading with a minimum of operator attention.

Introducing elongated magnetic articles into containers

Elongated magnetic diodes 12 are removed from a carrier 20 having a periphery along which the diodes 12 are advanced. A magnetic bin 75 has spaced sidewalls 76 and 77 extending to either side of the periphery of carrier 20. There is established between and transverse to the sidewalls a first magnetic field of sufficient strength to remove the diodes 12 from along a first distance at a first location on carrier 20. There is provided a movable retention mechanism 70 for optionally magnetically retaining the diodes 12 on carrier 20 as such diodes 12 are advanced along and beyond the first location and over a second distance to a second location. Mechanism 70 has a magnetic member 93 fixedly disposed along the second distance and a movable magnetic member 95 of sufficient length to retain the diodes 12 along the first distance. Member 95 is pivotally mounted to member 93 and member 95 is disposed in a normally inactive position within carrier 20. To interrupt removal by bin 75, member 95 is moved to an active position such that a composite magnetic structure 90 is formed, extending for the first and second distances over which the diodes 12 are then retained on carrier 20.

Removing magnetic articles from a carrier

An axially leaded diode (12), travelling at a high rate of speed in a longitudinal direction, is terminated within a bin assembly (18). The bin (18) has first and second ends (43 and 44) and first and second sidewalls (21 and 22) including magnets (33-41) therein to orient a diode (12) transversely to such sidewalls. A tube (48) guides the diode (12) on a path forming a given angle 'A' with the sidewalls (21 and 22). A discharge end (49) of tube (48) is located at the first sidewall (21) such that the diode (12) is discharged toward the second sidewall (22). A deceleration apparatus (54) is provided at discharge end (49) of tube (48) and spaced therefrom. Apparatus (54) includes a vertical bar (65) with a row of deceleration elements (66) extending therefrom toward the first end (43) of the bin (18). The row of elements (66) provides a penetrable restraint (64) such that a first lead (14) of a diode (12) discharged from tube (48) penetrates between the elements (66). The body (16) of the diode (12) impinges upon and is slidably restrained along the elements (66). As the diode (12) advances out of the elements (66) said diode is rotated to an orientation transverse of bin (18).

Decelerating and reorienting elongated magnetic articles

Elongated magnetic articles 12 are introduced into vacant positions 31 on a carrier wheel 18 for a given operation. A magnetic bin 40 has a feed end in communication with wheel 18 and includes spaced sidewalls 41-44, with arm sections 43-44 thereof extending substantially beyond the periphery of wheel 18 and along the sides thereof. There is established between said sidewalls 41-44 a first, magnetic field and a second, stronger field to orient and suspend the articles 12 in bin 40. However, the field between arm sections 43-44 is established substantially within the periphery of wheel 18 and such field includes the stronger second field located in a specific region of arm sections 43-44. For loading articles 12 into continuously occurring vacant positions 31 which are advanced in an ascendent path, the stronger second field is located in a lower region of arm sections 43-44. For a difficult make-up function, articles 12 are introduced into randomly occurring vacant positions 31 as such are advanced in a descendent path. A bin 80 also has a strong second magnetic field located within the periphery of wheel 18; however, such field is confined to an upper region of arm sections 83-84 and there is a non-magnetic lower region to avoid downwardly attracting articles 12. In a taping operation, means are employed to machine sense all diodes, to machine eject unacceptable diodes 13 and to machine count all diodes and positions 31. Input is made to a microprocessor which determines the exact time to control various functions on a substantially automatic basis.

Introducing elongated magnetic articles into vacant positions on a

Elongated magnetic articles 12 are transferred directly from a magnetic bin 17 and transported on a member 80 having deep slots 84 to retain the articles 12 for treatment. In a preferred example, the articles 12 include some articles 13 having undesirably shaped leads 14 and the treatment comprises lead straightening. A system of magnets 30 generates a magnetic field in the bin 17 which suspends and orients a supply of the articles 12 and 13 such that a dense, rotating pattern of articles is formed and urged against member 80. A pair of supports 57 and 58 limit the depth of the slots 84 at a first level to prevent more than one article 12 or 13 to enter therein. As an entered article 12 or 13 advances beyond the supply of articles, the supports 57 and 58 are discontinued and the entered article moves to a second level. Portions of the magnets in the bin 17 are advantageously extended, without discontinuities, along the edges of the transport area to form a system of magnets 34 which communicates from end to end of the articles 12 and 13 as they are advanced along the first and second levels. A system of magnets 70 generates a magnetic field directed inwardly of the slots 84 to attract the articles 12 and 13 to the first level and another system of magnets 55 generates a magnetic field transversely of member 80 to stabilize the articles in the slots 84. System 70 also generates a series of inwardly directed magnetic fields to attract the articles 12 and 13 and to retain them at the second level until they reach the treatment area.

Transferring and transporting elongated magnetic articles for treatment

Elongated articles (13), having an undesirable shape caused by a bent lead (14), are distinguished from elongated articles (12) which are desirably straight. The bent articles (13) are separated from a mass of articles (12 and 13), most of which are substantially straight. The articles (12 and 13) are typically axially leaded diodes having leads (14) which are magnetic. Such diodes (12 and 13) are successively introduced between sidewalls (11 and 22) of a bin (17) having a magnetic field which orients each article transverse to guide members (28 and 29) extending lengthwise of the bin (17). Each oriented diode (12 and 13) presents a distinctive configuration according to its shape when viewed against a plane transverse to the guide members (28 and 29). The major portion of a bent diode (13) will be disposed lower than the major portion of a straight diode (12). The diodes (12 and 13 ) are advanced in succession along the guide members (28 and 29) and the configurations of the diodes (12 and 13) form substantially parallel pathways through the bin (17). An interposing and separating mechanism (34) is located in the bin (17) adjacent to the pathways of the diodes (12 and 13). The mechanism (34) interposes at least one member (32) between the pathway of a diode (12) which is substantially straight and the pathway of a diode (13) which is unacceptably bent. The bent diode (13) strikes the interposed member (32) and becomes disoriented in the magnetic field of the bin (17). The bent diode (13) falls away from the guide members (28 and 29) and is drawn downwardly through an exit port (18) into an exit chute (44) which has a magnetic field to orient the diode (13). The straight didode (12) passes over the interposing member (32) and continues to advance along the guide members (28 and 29) to an outlet end (21) of the bin (17).

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Temple, PA, United States of America

Donald M Large