Xerox Corporation

The Perkin-elmer Corporation

Other

Nanonexus Corporation

Donald Leonard Smith

Christopher L Chua

Andrew Sebastian Alimonda

Eric Peeters

Koenraad F Van Schuylenbergh

David Kirtland Fork

Linda T Romano

Scott Alan Elrod

Jeng Ping Lu

Decai Sun

Francesco Lemmi

Richard G Stearns

Joy Roy

David Kalman Biegelsen

Vittorio R Castelli

Raj B Apte

Meng H Lean

Robert L Thornton

Babur B Hadimioglu

David H Tracy

Gregory J Kovacs

John S Berkes

John Stuart Fitch

James C Mikkelsen

Martin G Lim

Jerry Elkin

Patrick G Kim

An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Method of making photolithographically-patterned out-of-plane coil structures

The invention provides a method and apparatus for producing uniform, isotropic stresses in a sputtered film. In the presently preferred embodiment, a new sputtering geometry and a new domain of transport speed are presented, which together allow the achievement of the maximum stress that the film material can hold while avoiding X-Y stress anisotropy and avoiding stress non-uniformity across the substrate.

Method and apparatus for producing uniform isotropic stresses in a sputtered film

Photolithographically-patterned out-of-plane coil structures and method of making

A new type of high-Q variable capacitor includes a substrate, a first electrically conductive layer fixed to the substrate, a dielectric layer fixed to a portion of the electrically conductive layer, and a second electrically conductive layer having an anchor portion and a free portion. The anchor portion is fixed to the dielectric layer and the free portion is initially fixed to the dielectric layer, but is released from the dielectric layer to become separated from the dielectric layer, and wherein an inherent stress profile in the second electrically conductive layer biases the free portion away from the dielectric layer. When a bias voltage is applied between the first electrically conductive layer and the second electrically conductive layer, electrostatic forces in the free portion bend the free portion towards the first electrically conductive layer, thereby increasing the capacitance of the capacitor.

Photolithographically-patterned variable capacitor structures and method of making

A new type of high-Q variable capacitor includes a substrate, a first electrically conductive layer fixed to the substrate, a dielectric layer fixed to a portion of the electrically conductive layer, and a second electrically conductive layer having an anchor portion and a free portion. The anchor portion is fixed to the dielectric layer and the free portion is initially fixed to the dielectric layer, but is released from the dielectric layer to become separated from the dielectric layer, and wherein an inherent stress profile in the second electrically conductive layer biases the free portion away from the a dielectric layer. When a bias voltage is applied between the first electrically conductive layer and the second electrically conductive layer, electrostatic forces in the free portion bend the free portion towards the first electrically conductive layer, thereby increasing the capacitance of the capacitor.

A method of forming and moving ink drops across a gap between a print head and a print medium, or intermediate print medium, in a marking device includes generating an electric field, forming the ink drops adjacent the print head and controlling the electric field. The electric field is generated to extend across the gap. The ink drops are formed in an area adjacent the print head. The electric field is controlled such that an electrical attraction force exerted on the formed ink drops by the electric field is the greatest force acting on the ink drops. The marking device may be incorporated into a transfuse printing system having an intermediate print medium made of one or more materials that allow for lateral dissipation of electrical charge from the incident ink drops.

Method and apparatus for moving ink drops using an electric field and transfuse printing system using the same

This invention relates to a method and apparatus for acoustic ink printing using a bilayer configuration. More particularly, the invention concerns an acoustically actuated droplet emitter which is provided with a continuous, high velocity, laminar flow of cooling liquid in addition to a stagnant pool of liquid to be emitted as droplets.

Apparatus and method for acoustic ink printing using a bilayer printhead configuration

A spring contact includes a free portion having a tip. The free portion includes a contact surface and side surfaces. In some embodiments, a wear resistant material is formed on only selected portions of the tip. In other embodiments, the wear resistant material is formed on the contact surface and on the side surfaces. The wear resistant material increases the wear resistance of the spring contact. The spring contacts can be used in probes.

Wear-resistant spring contacts

This invention relates to an improved acoustic fluid emission head, e.g. an acoustic ink printhead, and a method of forming or assembling same. More particularly, the invention is directed to an acoustic ink printhead that advantageously incorporates elastomer gaskets to replace all epoxy joints in the printhead and a corrugated spacer to provide focal gap control in the printhead. A related method for manufacturing the printhead includes folding and spot welding the aperture plate of the printhead to maintain the elastomer gaskets in place and, consequently, control the focal gap.

Acoustic fluid emission head and method of forming same

A photolithographically patterned spring contact is formed on a substrate and electrically connects contact pads on two devices. The spring contact also compensates for thermal and mechanical variations and other environmental factors. An inherent stress gradient in the spring contact causes a free portion of the spring contact to bend up and away from the substrate. An anchor portion remains fixed to the substrate and is electrically connected to a first contact pad on the substrate. The spring contact is made of an elastic material and the free portion compliantly contacts a second contact pad, thereby electrically interconnecting the two contact pads. The free portion is initially fixed to the substrate to intentionally form the inherent stress gradient in the elastic member. The free portion is released from the substrate by etching a release layer deposited on the substrate so the inherent stress gradient in the elastic member biases the free portion away from the substrate. A contact tip of the spring contact can be coated with solder.

Photolithographically patterned spring contact

A method of fabrication is provided for multi-step microlithographic structures including Fresnel lenses whereby the process includes the formation of intermediate etch stop layers that are embedded with the structure material. This is accomplished in one aspect of the invention by depositing Fresnel lens material using known techniques and the selectively altering the chemistry of the material being deposited to form the intermediate etch stop layers at suitable positions without interrupting the deposition process. In another aspect, etch stop layers are patterned on layers of the lens material and embedded between such layers. The structure, or lens, is then formed using masking, patterning and etching techniques.

Method for fabrication of multi-step structures using embedded etch stop layers

A photolithographically patterned spring contact is formed on a substrate and electrically connects contact pads on two devices. The spring contact also compensates for thermal and mechanical variations and other environmental factors. An inherent stress gradient in the spring contact causes a free portion of the spring contact to bend up and away from the substrate. An anchor portion remains fixed to the substrate and is electrically connected to a first contact pad on the substrate. The spring contact is made of an elastic material and the free portion compliantly contacts a second contact pad, thereby electrically interconnecting the two contact pads.

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Bolinas, CA, United States of America

Donald Leonard Smith