Avago Technologies General IP (Singapore) Pte. Ltd.

Other

Avago Technologies Wireless IP (Singapore) Pte. Ltd.

Versevo, Inc.

Donald Lee

Richard C Ruby

Qiang Zou

John Choy

Martha K Small

Osvaldo Buccafusca

David Martin

Joel Philliber

Wei Pang

John Dwight Larson, Iii

Kevin J Grannen

Suresh Sridaran

Hongjun Feng

Urupattur C Sridharan

Tina L Lamers

Kristina Lamers

Carrie A Rogers

Frank Bi

Zhiqiang Bi

Barry Jinkins

Collapsible core devices, related methods and injection molding tools for use in injection molding processes, the core device configured to collapse upon rotation of a centrally disposed rotating shaft. In some aspects the core device includes a rotatable shaft, moveable outer wall components positioned radially from the shaft, a first disk operatively engaged with the shaft and having at least a first slot configured to receive a first pin connected to a moveable outer wall component, and a second disk secured in a fixed position and having at least a second slot configured to receive the first pin, such that rotation of the rotatable shaft causes the pin to slide within the second slot toward the shaft and causing the outer wall component to move toward the shaft.

Collapsible core devices and method for injection molding

A bulk acoustic wave (BAW) resonator device comprises a heating coil disposed over a first side of the piezoelectric layer and substantially around a perimeter adjacent to the active area of the acoustic resonator, the heating coil comprising a resistor configured to receive a heater current; and a heat sensor disposed over a second side of the piezoelectric layer and opposing the first side, the heat sensor configured to adjust the heater current in response to a temperature of the heating coil.

Temperature controlled acoustic resonator comprising heater and sense resistors

An acoustic resonator device comprises: a substrate comprising a cavity or an acoustic mirror; a first electrode disposed over the substrate; a piezoelectric layer disposed over the first electrode; and a second electrode disposed over the piezoelectric layer. The first electrode or the second electrode, or both, are made of an electrically conductive material having a positive temperature coefficient.

Temperature compensated acoustic resonator device

An acoustic resonator device includes a composite first electrode on a substrate, a piezoelectric layer on the composite electrode, and a second electrode on the piezoelectric layer. The first electrode includes a buried temperature compensating layer having a positive temperature coefficient. The piezoelectric layer has a negative temperature coefficient, and thus the positive temperature coefficient of the temperature compensating layer offsets at least a portion of the negative temperature coefficient of the piezoelectric layer.

Resonator device including electrode with buried temperature compensating layer

An acoustic resonator comprises: an acoustic resonator device comprises: a composite first electrode disposed over a substrate, the composite first electrode comprising: a first electrically conductive layer provided over the substrate; a first interlayer disposed on the first electrical conductive layer; a buried temperature compensation layer disposed over the first interlayer; a second interlayer disposed over the temperature compensation layer; a second electrically conductive layer disposed over the second interlayer, a piezoelectric layer disposed over the composite first electrode; and a second electrode disposed over the piezoelectric layer.

Temperature compensated acoustic resonator device having an interlayer

A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.

Temperature control of micromachined transducers

The temperature-compensated film bulk acoustic resonator (FBAR) device comprises an FBAR stack that comprises an FBAR characterized by a resonant frequency having a temperature coefficient and a temperature-compensating layer comprising doped silicon dioxide. The FBAR comprises opposed planar electrodes and a piezoelectric element between the electrodes. The piezoelectric element has a temperature coefficient on which the temperature coefficient of the resonant frequency of the FBAR depends at least in part.

Film bulk acoustic resonator (FBAR) devices with temperature compensation

An advanced automated vessel cargo transfer system for loading and unloading of ships and lighters. It includes an articulated manipulator arm mounted on a frame. The arm is provided with a spreader bar at the distal end thereof. The spreader bar is provided with facilities for grasping cargo. Sensors track the movement of the vessel, and automatically responsive controllers adjust the motion and position of the spreader bar to follow the motion of the vessel. Berthing modules are provided to aid in controlling the motion of the vessel. In a major embodiment, the manipulator arm is mounted on a transverse frame that bridges spaced-apart floating barges, and provisions are made for serving vessels both on the outboard and inboard sides of the barges. In another embodiment, the manipulator arm is shore-based.

Automated all-weather cargo transfer system

Disclosed is a ground fault detection system utilizing a distributed array of current rate of rise sensors located at and coupled to the various power substations of an underground trolley system. Threshold detectors and logic circuits measure and compare the rate of rise of current at the various substations with preselected threshold values to distinguish ground faults from normal load transients due primarily to locomotive start-up.

Growing community of inventors

Fort Collins, CO, United States of America

Donald Lee