Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Other

Donald L Michael

John D Rhodes

Charles Craig Haluzak

Jeffrey D Langford

Eric Joseph Johnson

James A Harvey

Harold F Mantooth

Carrie E Harris

Chien-Hua Chen

Jefferson Patrick Ward

Joseph Edward Scheffelin

Anthony Donald Studer

Alan Shibata

Kevin E Swier

James P Kearns

Neal W Meyer

Martha A Truninger

Mohammad Akhavain

John H Dion

Kit C Baughman

Eric Stephen Mattis

Gary Douglas Powell

Catherine A Rotering

Frank J Bretl

Ross E Friesen

Gerald E Heppell

Lee Van Nice

Winthrop D Childers

Moses Mekala David

Michael L Bullock

Daniel W Petersen

David Ridgway Otis, Jr

Rui Yang

Kris M English

Brian L Helterline

Kit L Harper

Matthew David Beasley

William E Lewey

Ian Patrick Anderson

James R White

Nancy Leigh Herald

Marilyn Louise Zuber

Susan A Chavez

Thach G Troung

Bloor Redding, Jr

Hal Mantooth

Stephen M DeRoos

James E Green

A service station for use with a fluid ejection device having a fluid-ejection mechanism with at least one nozzle includes a housing configured to attach to the fluid-ejection mechanism and to remain attached to the fluid-ejection mechanism during the fluid-ejection operation. A shutter arranged within the housing includes at least one opening, and is selectively moveable between a closed position and an open position with respect to the nozzle. In the open position the opening exposes the nozzle and in the closed position the nozzle is covered. An actuation mechanism separate from the housing is positioned to selectively couple with the shutter, such that activation of the actuation mechanism causes the shutter to move between the open and closed positions.

Fluid-ejection device service station

A service station for a fluid-ejection mechanism of a fluid-ejection device includes one or more mechanisms. The mechanisms move back and forth over the fluid-ejection mechanism to wipe the fluid-ejection mechanism. The mechanisms cap the fluid-ejection mechanism during periods of nonuse of the fluid-ejection mechanism. The service station is mounted on the fluid-ejection mechanism, and remains mounted on the fluid-ejection mechanism while the fluid-ejection mechanism is used to eject fluid onto media. The fluid-ejection device is moved by a user to properly eject the fluid onto the media.

In one embodiment, a printhead assembly includes: an ink reservoir; a printhead; a passage for carrying ink from the ink reservoir to the printhead; and a port from the passage to a source of air pressure. The port is operable between a closed position in which the passage is not pressurized with air and an open position in which the passage is exposed to pressurized air. In another embodiment, an ink supply includes: a reservoir for holding ink; a printhead; a standpipe connecting the reservoir and the printhead such that ink may flow from the reservoir to the printhead through the standpipe; and a valve operatively connected to the standpipe. The valve is operative between a first position in which the standpipe is pressurized with air and a second position in which of the standpipe is not pressurized with air.

Printhead evacuation mechanism and method

This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.

Methods for hermetic sealing of post media-filled MEMS package

A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

Package having bond-sealed underbump

One embodiment of a method of storing a printhead includes opening a valve to a vent of an ink reservoir, operating a pump in a first direction to pull ink from the ink reservoir through said valve, and pumping the ink pulled from the ink reservoir to an ink supply container.

Ink recirculation system

A valve mechanism and a method for preparing an inkjet print cartridge and printer for inactivity is herein disclosed. Pressurized fluid is introduced to a standpipe volume to create a pressure differential that forces ink within the standpipe into an ink reservoir.

Printhead de-priming

A method of operating an arc discharge lamp that has first and second electrodes is described. First, the first electrode is heated with a third electrode with a first arc until the first electrode temperature is sufficiently elevated to allow for thermionic emission. Then, a first voltage is applied between the first and second electrode at a voltage less than 1000 volts to create a second arc.

Three electrode arc-discharge lamp

An inkjet printhead and a method for increasing the shelf life thereof are herein disclosed. The inkjet printhead has one or more nozzles for dispensing a colorant. These nozzles are fluidically connected to a reservoir. A first colorant substantially fills the nozzles while a second colorant is reserved in the reservoir.

Method and apparatus for reducing nozzle failure in stored inkjet printheads

The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Methods and systems for forming a die package

A method of removing gas from a printhead is provided. A sealing material may be applied to orifices of a printhead from external the printhead to restrict passage of fluid through the orifices. Ink may be moved through a printhead conduit disposed in fluid communication with the orifices to create an inward suction adjacent the orifices so that the gas is displaced from adjacent the orifices.

Removing gas from a printhead

A wet-wiping printhead cleaning system including a treatment fluid applicator placing treatment fluid on at least one of two elements involved in wiping, said two elements being a printhead orifice plate surface and a wiper, the system being so configured that treatment fluid is applied before wiping the printhead by projecting treatment fluid onto at least one element through the atmosphere, thereby avoiding direct contact between the applicator and said one element, the treatment fluid being placed so as to be available to assist in wiping a portion of the printhead orifice plate where the nozzle orifices are located to remove debris that may have accumulated, the treatment fluid lubricating the wiper so as to lengthen wiper service life and enhance wiping performance, as well as acting to render such accumulations more removable by wiping, the source of treatment fluid being uncontaminated by contact with either the printhead or the wiper.

Wet wiping printhead cleaning system using a non-contact technique for applying a printhead treatment fluid

System and methods for hermetic sealing of post media-filled MEMS package

Growing community of inventors

Monmoth, OR, United States of America

Donald L Michael