Thermalloy, Inc.

Other

Lucent Technologies Inc.

Aavid Thermalloy, LLC

Aavid Thermolloy, LLC

Donald L Clemens

William D Jordan

Matthew C Smithers

Gary F Kuzmin

Steven F Edwards

David W Gailus

Howard G Hinshaw

Kon Mang Lin

Ralph E Stenerson, Jr

Michael M Heatly

Keith Mandell

Mark C Mellinger

Theophilus Ifeanyi Ejim

Mark Mellinger

Steven A Edmiston

A heat collector () is formed by at least one extruding step for reducing machining steps, and is assembled to a separately formed mounting frame () which may be stamped and formed or molded. The heat collector has flanges () which bear against retaining tabs () formed on the mounting frame, and may be held by solder, glue, or mechanical means. The heat collector may receive a heat dissipator (), or may be formed as a heat sink () such as a pin-fin type heat sink. The mounting frame can be fixed to a printed circuit board or the like having a component such as a central processing unit which contacts the collector in order to cool the unit.

Heat collector with mounting plate

An apparatus and method for thermally coupling a heat sink directly to a surface mount heat generating device package in a manner which provides a more efficient thermal path between the heat sink and the device package, and which allows for a simplified assembly process. The heat sink is mounted in direct thermal communication with the heat generating device package which is surface mounted to a printed circuit board or other substrate. The inventive heat sink has a reservoir of thermal preform which allows the heat sink to be secured to a device package at the same time as the device package is being secured to the surface mount substrate, as opposed to doing so in a separate step in the assembly process after the electronic device packages have already been secured to the surface mount substrate. The inventive heat sink thereby simplifies the assembly process by eliminating steps in the manufacturing process and by allowing for the further automation of the assembly process.

Apparatus and method for direct attachment of heat sink to surface mount

A clip secures a pin fin heat sink to a fan. The clip includes a frame having a width which can be wedged between the fins of the heat sink. Blades extend downwardly from the frame and bear against the heat sink fins to secure the frame to the heat sink. The clip is locked in place by barbs which extend upwardly to engage the fins of the heat sink when the clip is urged in a direction which would free it of the heat sink.

Fan attachment clip for heat sink

A strap spring mounts a heat sink to an electronic device by snapping holes in the leg over ears of a catch on the socket. Two perpendicularly extending springs have an opening between them so that the springs fit between the fins of a heat sink and are latched in ratched indentations.

Strap spring for heat sink clip assembly

A heat sink adapted to thermally couple to a surface mounted heat generating electronic device package in a manner which provides an increased thermal path between the heat sink and the electronic device package. The heat sink is typically mounted piggyback on a heat generating electronic device package which is surface mounted to a printed circuit board or other substrate. The heat sink comprises thermal legs which extend from the heat sink body and are thermally coupled to thermal leads of the heat generating electronic device package.

Heat sink for direct attachment to surface mount electronic device

A heat dissipation system for a heat generating electronic device includes a releasable attachment assembly for removably securing a heat sink to a heat spreader plate thereof includes at least one spring clip for biasing the heat spreader plate into a secured engagement with the heat sink. The spring clips are adapted to allow easy engagement and/or disengagement of the heat sink from the heat spreader plate, thereby facilitating the use of variously configured heat sinks as part of the heat dissipation system.

Heat dissipation system having releasable attachment assembly

A heat sink having a support base which supports a base plate is used to mount one or more device packages on a circuit board or the like. The support base is adapted to be secured to the circuit board. The base plate has opposed major faces adapted for mating with device packages. Tongues or clips secure individual device packages on the major faces of the base plate independently to that device packages may be removeably attached to either or both sides of the base plate.

Attachment of electronic device packages to heat sinks

A mounting assembly for thermally coupling a heat sink to a surface mounted heat generating electronic device package. The mounting assembly essentially comprises a heat generating device package, a mounting attachment, and a heat sink. The mounting attachment and heat generating device package are surface mounted to a PCB or other substrate in mutual thermal communication with a thermal pad on the substrate. The mounting attachment is adapted to facilitate the effective dissipation of heat from surface mounted heat generating electronic device packages while allowing for the post-manufacture installation and exchange of heat sinks.

Heat sink mounting assembly for surface mount electronic device packages

A clip assembly and method of attachment for a heat sink having a pin-fin array employing thermally conducting tape to secure the heat sink to a heat dissipating BGA component together with at least one clip assembly which is secured to the underside of the component at its edges.

Heat sink and attachment process for electronic components

A spring clamp and insulating shoe assembly is used to secure a finned heat sink to an electronic device package. The spring clamp body fits between or around fins or pins extending from one face of a heat sink and carries an insulating shoe which fits around the edge of the device package and has a lip which engages the opposite face of the device package to urge the device package and heat sink into mutual contact.

Spring clamp assembly with electrically insulating shoe

A finned heat sink is constructed from a base having parallel grooves with a latching lip. The fins are individually formed with a retaining boss adjacent one edge which is adapted to mate with the latching lip to secure the fin in the groove. Spacing tabs are formed on the fins to assure uniform parallel spacing between the fins when assembled.

Growing community of inventors

The Colony, TX, United States of America

Donald L Clemens