Sierra Research and Technology, Inc.

Htc Corporation

Sr Technologies, Inc.

Other

Hybrid Technology Corporation

Usm Corporation

Donald J Spigarelli

John M DeCarlo

Douglas J Peck

James L Finney

William F Drislane

Karl E Bahr

Walter J Hall

Bryan R Hotaling

H Patrick Thornton

Ernest LaFleur

Bryan R Pinette

Paul C Dustin

Robert E Cushman

Mark Finocchario

John A Romano

A placement apparatus for placing and mounting circuit components or devices in aligned combination with circuit boards. The apparatus includes an imaging system, a first stage moveable in first and second opposite directions between first and second predetermined positions, for positioning the circuit board onto which the component is to be placed within a field of view of the imaging system. A second stage, for holding the circuit component, is movably coupled to the first stage. The apparatus further includes a component pick-up system disposed about the first stage for picking up the circuit component from the second stage and placing the circuit component in a predetermined position on the first stage. The imaging system is coupled to a graphical user interface system for providing a position indicator on a monitor screen, wherein the position indicator identifies the location of a particular feature of the circuit board or the circuit component.

Placement system using a split imaging system coaxially coupled to a

A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes an image acquisition processing subsystem. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective.

System for placement and mounting of fine pitch integrated circuit

A processing system includes at least one processing chamber, a conveyor disposed through the chamber and a drive unit coupled to the conveyor and intermittently activated by a drive controller for driving the conveyor for a first predetermined interval of time at a preselected one of a plurality of speeds and stopping the conveyor for a second predetermined interval of time. The processing system further includes a temperature control system to provide the processing chamber with a first internal region having a first predetermined temperature and a second internal region having a second predetermined temperature, and one or more temperature sensors disposed to monitor the temperature in at least one predetermined region of the processing chamber.

Soldering system

An integrated circuit device support tool which includes a device for providing a vacuum for holding an integrated circuit device to be soldered to a printed circuit board. The tool also includes a plurality of thin, pressure transferring members for pressing the leads of the integrated circuit device against a printed circuit board during soldering. The pressure transferring members are of a thin material so as not to provide a heat sink during the soldering operation.

Method of soldering an integrated circuit

A combined radiative and convective rework system is provided for repair, replacement, removal and rework of an electronic component on a printed circuit board. The system includes a guide for guiding heat-inducing radiation and heated gas towards at least one lead of the electronic component, and for preventing the heat-inducing radiation from damaging the body of the component. A heater, including a source of infrared radiation, provides the heat-inducing radiation and the heated gas. In one embodiment, the guide includes a single funnel cooperative with apparatus for reducing component body heating. In second and third embodiments, the guide includes two concentric funnels which form a volume which is traversed by the heat-inducing radiation and heated gas, and which provide at least one narrow region of heat energy to at least one of the leads, but not directly to the component body. In another embodiment, a plurality of removable guides are provided, each being specialized for use with a variety of different component types and sizes. The system also includes a viewing system for viewing the component along a central axis of symmetry of the guide.

Combined radiative and convective rework system

An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes an array of IR lamps and associated lamp envelopes and lenses, together with control apparatus for operating the IR lamps and aligning the focused IR radiation generated thereby. The radiation generated by the IR lamps is configured to provide a desired line pattern of energy which is directed onto the leads of a device being soldered. The perimeter of the energy pattern is programmably alterable to suit particular device lead sizes and configurations.

Infrared heater array for IC soldering reflective members

A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes a mechanical positioning subsystem, an image acquisition/processing subsystem, a master control subsystem, and optionally, a heater array subsystem. The mechanical positioning subsystem is sequentially operative to position the circuit board and IC device for the generation of images thereof, to align the IC device with a designated placement site on the board, and to mount the IC device in aligned combination with the board. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective. Images generated by the image acquisition subsystem provide feedback control to regulate the placement process to attain and verify lead-to-pad alignment. The heater array subsystem is utilized to bond the IC device to the circuit board while the mechanical positioning subsystem maintains the IC device in aligned combination with the board.

A method is provided for non-contact and contact sensing of phase changes of a solder material. By adding solder to a preexisting solder joint or substrate, an infrared sensor with limited resolution capability is able to discriminate between various solder characteristics at the solder enhanced site and other thermally distracting components when the solder transitions from a solid to a liquid phase or from a liquid to a solid phase. One type of contact sensing of solder reflow is accomplished by holding a thermocouple against a solder joint. When the pre-existing solder volume is insufficient to produce the desired results, additional solder is added to the solder joint or lead. The additional solder may be solid solder, a solder pre-form, or solder paste. Contact sensing may also be achieved by placing a spring loaded probe against the solder and detecting the probe's movement as the solder softens. In another contact reflow detection technique, a thermocouple sensor is housed in a protective sleeve fillable with solder paste or molten solder. The sensor is placed against a substrate adjacent a solder joint, and is heated simultaneously with the solder joint. Detection of solder reflow in the sleeve by the thermocouple signals reflow of the adjacent solder joint.

Sensing of solder melting and solidification

A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes an image acquisition/processing subsystem. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective. Images generated by the image acquisition subsystem provide feedback control to regulate the placement process to attain and verify lead-to-pad alignment.

A contact heater for soldering and desoldering electronic components that is heated by hot air supplied into a cavity of the contact heater. A thermally conductive heating blade is used to contact an area to be heated, while a heat shield protects adjacent electronic components from external heat generated by the contact heater.

Electronic component heater

An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes a rectangular frame member having four radiation slits, a rectangular array of four IR lamps and associated lamp envelopes mounted in combination outside the frame member, X and Y pairs of reflecting members rotatably mounted within the frame member, and control subsystems for operating the IR lamps and aligning the focused IR radiation generated thereby. The radiation generated by the IR lamps is convergingly reflected by the associated lamp envelopes to pass through the radiation slits toward the rotational axis of the X and Y pairs of reflecting members. The X and Y pairs of reflecting members are rotationally oriented to reflect IR radiation onto the bonding sites to effect bonding of the FPD to the circuit board.

Infrared heater array for IC soldering

Electronic circuit board rework and repair system

A system is disclosed for viewing the aligning and soldering of an electrical component to a printed circuit board. The novel system provided the operator with a clear, close up view of the work area allowing the operator to accurately position electrical components on the work surface. Images of different sectors of the work area are received by a viewing device such as a video camera, are processed and electronically transferred to the operator's display terminal. The multiple images are displayed simultaneously on the operator's terminal. By viewing the display terminal, the operator is able to observe simultaneously the critical sectors of the work area while manipulating the electrical component with a pick-and-place head to accurately align and place the component in a pre-determined position.

Multi-vision component alignment system

An electronic circuit board rework and repair system having a carriage manually movable to successive station positions and having a table thereon movable along mutually orthogonal axes for positioning of a circuit board clamped to the table. At a first station, a circuit board is loaded onto the table, and a microscope can be swung into position for inspection of the loaded board. At a second station, an intended component or circuit board site can be aligned by way of a visual image of the component and site, and the table locked in position. At a third station, the selected component or circuit board site is automatically in alignment with a programmable heater for selected heating of the component contacts and removal of the component by a pickup probe associated with the heater. The system is calibrated such that there is alignment between a visually established position at the second station and that component position under the heater at the third station. Components can also be attached to selected sites of a circuit board by operation of the system.

Apparatus especially useful for centering an electronic component on a surface for subsequent pickup and placement on a circuit board. The apparatus includes a pair of jaws which are driven in unison toward and away from each other by a lead screw or similar mechanism, each of the jaws having a part adapted to engage a respective side of a component to be positioned. The engagement part of each jaw is resiliently loaded such as by a spring or air cylinder and is in a normally outward position. The jaws are pre-aligned so that they drive in unison toward a predetermined center line. A component place between the jaws is contacted by the engagement parts of the jaws when the jaws move toward each other, and is moved into alignment on the center line. The jaws over-travel the aligned position against the spring pressure of the jaws, this spring pressure providing an intended over-travel force which prevents excessive force on the component by the engaged jaws. The over-travel also allows acceptance of a range of component sizes for the same jaw configuration.

Growing community of inventors

Carlisle, MA, United States of America

Donald J Spigarelli