Texas Instruments Corporation

Donald J Rigsby, Jr

Neal T Murphy

Daryl Ross Koehl

Claire Ching-Shan Jung

Bing Ouyang

Gurshaman S Baweja

A method for collecting data from semiconductor equipment includes selecting a plurality of data values to request from semiconductor equipment and assigning each of the data values to a chamber. Each chamber is associated with an engine that processes the data values in the associated chamber to detect a fault in the semiconductor equipment. The method also includes determining an order to receive the data values from the semiconductor equipment, and, after the order for the data values is determined, communicating a setup message requesting the semiconductor equipment to communicate the data values in the predetermined order. The method further includes receiving the data values from the semiconductor equipment and providing each of the received data values to the particular engine associated with the chamber of the data value.

Method for collecting data from semiconductor equipment

A system and method are disclosed including a vapor dryer chamber ( ) with a lid ( ). A heater ( ) is disposed within the vapor dryer chamber to vaporize liquid drying medium ( ), preferably isopropyl alcohol, in the bottom of the vapor dryer chamber ( ). Cooling coils ( ) disposed within an upper portion of the vapor drying chamber ( ) condense the drying medium vapor. A vapor monitor assembly ( ) is disposed within the vapor dryer chamber ( ) to monitor the vapor concentration within vapor dryer chamber ( ). A controller ( ) is associated with the vapor monitor assembly ( ) and evaluates vapor concentration measurements from the vapor monitor ( ).

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Garland, TX, United States of America

Donald J Rigsby, Jr