Applied Materials, Inc.

Empyrean Medical Systems, Inc.

Sensus Healthcare, Inc.

Donald J Olgado

Avi Tepman

Joseph Stevens

Gerald Z Yin

Mark Robert Denome

Brian Patrick Wilfley

Tobias Funk

Chwen-Yuan Ku

Kalman Fishman

Petre Vatahov

Christopher R Mitchell

Christopher W Ellenor

Yezdi N Dordi

James S Papanu

Diana Xiaobing Ma

Ho Seon Shin

Steve S Mak

Dmitry Lubomirsky

Yan Ye

Robin W Cheung

Dan Maydan

Ratson Morad

Ashok K Sinha

Peter K Loewenhardt

Dan A Marohl

Michael N Sugarman

Peter W Hey

Timothy D Driscoll

Dan Carl

George Birkmaier

Eugene Ravinovich

Hiroji Hanawa

Liang-Yuh Chen

Gerald Zheyao Yin

Allen L D'Ambra

Jeng H Hwang

Yeuk-Fai Edwin Mok

Joe Stevens

Bernardo Donoso

Yevgeniy Rabinovich

Mark Lloyd

Sandy S Chao

Feng Quan Liu

Alexander Sou-Kang Ko

Stan D Tsai

Harald Herchen

Shamouil Shamouilian

Karl M Brown

Girish Anant Dixit

Wei-Yung Hsu

Sen-Hou Ko

Timothy Joseph Franklin

Rashid Mavliev

Simon Yavelberg

Howard E Grunes

David Palagashvili

Gary C Ettinger

Lu Yang

Hooman Bolandi

Ian A Pancham

Steve S Y Mak

Victor Pebenito

Jon T Clinton

Sheshraj L Tulshibagwale

Brian Shieh

Muhammad Atif Malik

Yonatan Vainer

Steven Sy Mak

Henan Hao

Timothy H Franklin

Erik C Wasinger

Anna Marie Lloyd, Legal Representative

Hanzhong Zhang

Alex Ko

Anada H Kumar

Ricardo Leon

Systems and methods for generating X-ray photons. The methods comprise: generating an electron beam; positioning hollow pedestals in the path of the electron beam (the hollow pedestals being radially spaced apart from each other and extending out and away from a major planar face of a base plate); generating X-ray radiation as a result of an interaction of the electron beam with target element(s) disposed at a distal end of a respective pedestal of the hollow pedestals; causing the X-ray radiation to interact with a beam shield comprising wall elements extending out and away from the major planar face of the base plate; and setting at least one of a beam shape and direction of the X-ray radiation by selectively controlling a location where the electron beam intersects the target element(s) to determine an interaction of the X-ray radiation with the wall elements.

Three-dimensional beam forming X-ray source

X-ray target element is comprised of a planar wafer. The planar wafer element includes a target layer and a substrate layer. The target layer is comprised of an element having a relatively high atomic number and the substrate layer is comprised of diamond. The substrate layer is configured to support the target layer and facilitate transfer of thermal energy away from the target layer.

Validation of a therapeutic radiation treatment involves using an applicator balloon surrounding an X-ray radiation source to support a plurality of X-ray sensor elements (XRSE). The XRSE are supported on the applicator balloon at distributed locations to sense applied radiation from the radiation source. At least one parameter of the applied radiation which has been sensed by the XRSE is compared to a corresponding parameter of a predetermined radiation treatment plan. Based on the comparing, a determination is made as to whether one or more requirements of the predetermined radiation treatment plan have been satisfied.

Validation of therapeutic radiation treatment

Three-dimensional beam forming x-ray source

Three dimensional beam forming X-ray source includes an electron beam generator (EBG) to generate an electron beam. A target element is disposed a predetermined distance from the EBG and positioned to intercept the electron beam. The target element is responsive to the electron beam to generate X-ray radiation. A beam former is disposed proximate to the target element and comprised of a material which interacts with the X-ray radiation to form an X-ray beam. An EBG control system controls at least one of a beam pattern and a direction of the X-ray beam by selectively varying a location where the electron beam intersects the target element to control an interaction of the X-ray radiation with the beam-former.

A method and apparatus for forming an electrochemical layer of a lithium ion battery is provided. A precursor mixture in a carrying medium is activated in a reactor chamber by application of energy to synthesize active materials. The activated precursor mixture is then spray deposited on a substrate. A binder and conductive materials may be blended, or sprayed separately, with the nano- or micro-crystals as they deposit on the surface to enhance adhesion and conductivity.

Hydrothermal synthesis of active materials and in situ spraying deposition for lithium ion battery

Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

Methods and apparatus for processing a substrate

The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

Electro-chemical deposition system

A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing solution to the polishing pad substantially within the polishing area during the polishing operation. A polishing solution retaining mechanism is attached to one of the base or the carrier head assembly. The retaining mechanism engages a top surface of the polishing pad and retains the polishing solution substantially within the polishing area during the polishing operation. Some implementations may reduce polishing solution consumption and allow for increased angular velocity.

Polishing solution retainer

A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.

Apparatus for electro chemical deposition

A lifting mechanism includes a plurality of lift pins which may be driven separately and independently upward to engage an alignment surface of the chamber using ambient atmospheric pressure as the chamber is evacuated by a pump. In the illustrated embodiment, each lift pin includes a piston which is exposed to the internal chamber pressure on one side of the piston, and is exposed to the external ambient pressure on the other side of the piston. As the pump evacuates the chamber, the internal chamber pressure decreases, causing each lift pin piston to drive the associated lift pin upward. Once all the lift pins have securely engaged the alignment surface, the lift pins may be clamped to a linking mechanism to permit a motor to actuate the lift pins during processing operations.

Lift pin alignment and operation methods and apparatus

A method and apparatus for plating substrates, wherein the apparatus includes a central substrate transfer enclosure having at least one substrate transfer robot positioned therein. A substrate activation chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate plating chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate spin rinse dry chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot, and an annealing chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. At least one substrate pod loader in communication with the substrate transfer chamber and accessible to the at least one substrate transfer robot is also provided.

Electroless plating system

An apparatus and associated method for securing a wafer to a SRD spider, the SRD spider has a plurality of spider arms. The apparatus includes a plurality of spaced surfaces disposed on a distal end of one of the spider arms, each of the surfaces being spaced perpendicularly from the longitudinal axis of the spider arm. In one aspect, the two surfaces are positioned to limit production of a wedging force between that spaced surface and the wafer. In one embodiment, a post at least partially defines each one of the plurality of spaced surfaces.

Dual post centrifugal wafer clip for spin rinse dry unit

The present invention provides an apparatus and associated method in which the apparatus comprises a multiple blade robot and a compensating device. The multiple blade robot includes at least one set of robot blades. The compensating device adjusts for differences in spacing between the set of robot blades and spacing between two or more cells. In different embodiments, the compensating device may be coupled to one or more of the process cells, one or more of the substrate holder systems, or one or more of the robot blades.

Multiple blade robot adjustment apparatus and associated method

Growing community of inventors

Palo Alto, CA, United States of America

Donald J Olgado