Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Seagate Technology Incorporated

Donald J Milligan

Chien-Hua Chen

Eric T Martin

Robert G Walmsley

Sriram Ramamoorthi

Rodney L Alley

Timothy L Weber

Vincent C Korthuis

Dennis J Schloeman

Martha A Truninger

Timothy R Emery

Sean P McClelland

John Stephen Dunfield

Diane Lai

J Daniel Smith

Paul H McClelland

Naoto A Kawamura

Donald W Schulte

Terry E McMahon

Peter George Hartwell

John Paul Harmon

Jeremy Harlan Donaldson

Daniel A Kearl

Sadiq Bengali

Tim R Koch

Rogelio Cicili

Jennifer Wu

William J Edwards

Norman L Johnson

Kenneth J Abbott

In various examples, a fluid ejection device may include a substrate with a fluid feed hole and a corrosion-detecting conductive path or sensor disposed behind a wall of the fluid feed hold. The corrosion-detecting conductive path or sensor may close a circuit in response being exposed to a fluid contained within the fluid feed hole.

Fluid feed hole corrosion detection

A fluidic die may include a substrate supporting a fluid actuator address line and first and second groups of fluid actuators connected to the fluid actuator address line. The first group of fluid actuators may include first and second types of fluid actuators having different operating characteristics. The second group of fluid actuators may include the first and the second types of fluid actuators. The fluid actuators of the first and second groups have addresses such that a fluid actuator of the first type in the first group and a fluid actuator of the second type in the second group are both enabled in response to a single enabling event on the fluid actuator address line.

Fluidic die

In some examples, a fluid dispensing die includes a plurality of fluid actuators to cause dispensing of a fluid from respective nozzles of the fluid dispensing die, and an electrically conductive layer including electrically conductive ground structures to connect respective fluid actuators of the plurality of fluid actuators to a ground, wherein the electrically conductive layer includes gaps provided between the electrically conductive ground structures of the electrically conductive layer.

Gaps between electrically conductive ground structures

A multi-directional single pass printing apparatus may include a print head comprising a collection of slots. The collection of slots may include a central slot for delivering a central slot fluid type, a first serial arrangement of first slots on a first side of the central slot to deliver a first series of respective fluid types and a second serial arrangement of second slots on a second side of the central slot opposite the first side. The second series of slots are to deliver a second series of respective fluid types, wherein the second series of respective fluid types mirror the first series of respective fluid types with respect to the central slot fluid type.

Multi-directional single pass printing

A sensor having a particle barrier is described. In an example, a sensor includes: first and second electrode sets respectively disposed upon a planar support surface and a proof mass that is compliantly displaceable along a first axis substantially parallel to the planar support surface; and a first barrier disposed on the planar support around the first electrode set having a height less than a gap between the planar support and the proof mass to mitigate particle migration into the first or second electrode set.

Sensor having particle barrier

According to an example, multi-directional single pass printing may include utilizing a print head that includes slots that include a first slot for a first ink color, and two or more additional slots. A slot of the additional slots may be disposed on a first side of the first slot, and another slot of the additional slots may be disposed on a second side of the first slot. The additional slots may include a further ink color. Data may be forwarded to a set of slots when a direction bit related to the print head is set to a first value, and to another set of slots when the direction bit is set to a second value. A number of channels for forwarding the data to the slots may be less than the number of slots.

The present disclosure includes bonded wafer structures and methods of forming bonded wafer structures. One example of a forming a bonded wafer structure includes providing a first wafer () and a second wafer () to be bonded together via a bonding process that has a predetermined wafer gap () associated therewith, and forming a mesa () on the first wafer () prior to bonding the first wafer () and the second wafer () together, wherein a height () of the mesa () is determined based on a target element gap () associated with the bonded wafer structure.

Bonded wafer structures

The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel. One example of forming such structures includes providing a first wafercomprising a bond layer of a particular thicknesson a surface of a substrate materialremoving the bond layerin a first area--to expose the surface of the substrate materialapplying a mask to at least a portion of a remaining bond layer----and a portion of the exposed surface of the substrate material in the first area---to form a second area exposed on the surface of the substrate materialetching the second area to form a cavityin the substrate materialand the bond layerand forming by the etching, in the cavitya structure--for restricting out-of-plane travel, where the structure--has a particular height from a bottom of the cavitydetermined by the particular thickness of the bond layer

Out-of plane travel restriction structures

A method of forming a micro-electro mechanical system (MEMS), includes (1) removing material from a first wafer to define a first movable portion corresponding to an x-y accelerometer and a second movable portion corresponding to a z accelerometer, where each movable portion comprises at least one flexure member and at least one proof mass, each proof mass and flexure member being formed by the selective removal of material from a top side and a bottom side of first wafer; (2) bonding the first wafer to a second wafer comprising an electronic circuit, such that a gap is defined between the first wafer and the second wafer. The thickness of the at least one flexure member of the first movable portion is independent of a thickness of the at least one flexure member of the second movable portion and a thickness of the proof mass of the first movable portion is independent of a thickness of the at least one proof mass of the second movable portion.

Forming a micro electro mechanical system

Embodiments of a micro electro mechanical system are disclosed.

Micro electro mechanical system

A mass storage device includes a probe that has a cantilever having a first end region operatively connected to a substrate and a second end region rotated in a direction such that the second end region is opposed to the first end region. A tip is disposed on the second end region, with the tip pointing in a direction opposed to the first end region.

Integrated metallic contact probe storage device

A photonic crystal device is fabricated by a method comprising steps of providing a substrate, providing a photonic crystal on the substrate, and etching a cavity under at least the photonic crystal, the cavity having an inner wall adapted to reflect light.

Photonic crystal device and methods

A micro-electromechanical actuator and related methods of use that use a pair of electrodes separated by a linkage. The linkage is biased to a neutral position wherein the electrodes are spaced apart from each other, but also allows at least one electrode to move toward the other electrode when an appropriate force, such as voltage from the power source, is applied to the electrodes. The linkage is sized and shaped to allow the electrodes to move together when a defined threshold voltage is applied by the power source, thereby allowing the micro-elecromechanical actuator to function as a manufacturing quality testing device or a micromechanical actuator in other applications. The actuator may be fabricated simultaneously with other micromechanical and micro-electromechanical components on the same substrate using conventional semi-conductor and micro-machining manufacturing equipment.

Micro-electromechanical actuator and methods of use and fabrication

A movable system, such as a computer storage device, having a frame, a mover configured to move relative to the frame, and a mechanical suspension operatively coupled between the frame and mover. The mechanical suspension is configured to permit planar movement of the mover while substantially preventing out-of-plane movement, and includes a first flexure configured to flex in response to movement of the mover in a first direction relative to the frame, and a second flexure configured to flex in response to relative movement occurring in a second direction.

Growing community of inventors

Corvallis, OR, United States of America

Donald J Milligan