Huntsman Chemical Corporation

Ceramics Process Systems Corporation

Donald J Kelley

James M Joyce

Eric A Barringer

Sheldon I Lieberman

James D Hodge

Richard Waack

William C Gruber

Mark S Schmidt

Brian W Saxton

Certain organobromines are added to blends of polyphenylene ether and alkenyl aromatic polymer to reduce mold cool time of the composition. These organobromines also reduce residual blowing agent in the composition after expansion and especially following molding of the composition. The organobromines of this invention are as follows:

Polyphenylene ether - alkenyl aromatic polymer blends having

Polyphenylene ether-alkenyl aromatic polymer blends having organobromine

Glass-ceramic packages for integrated circuits containing multi-layer, interconnected thick film wiring patterns are obtained by co-sintering a glass-ceramic composite and copper, silver, palladium, gold, based conductors at temperatures not exceeding about 1000.degree. C. The dielectric systems include composites of borosilicate glasses and crystalline fillers which are fabricated by either mixing glass frit and the filler or by a sol-gel coating process. The package is fabricated using a tape specifically designed for clean binder burnout in a reducing atmosphere at low temperatures and also for superior mechanical and thermal properties. Metallization, applied by the thick film screening technique, utilized herein has glass-ceramic bonding agents designed to promote adhesion yet maintain the desired electrical properties and post-processing characteristics.

Co-fired metal-ceramic package

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Suffolk, VA, United States of America

Donald J Kelley