Microchip Technology Inc.

Ixys Corporation

Donald Humbert

Rohit Tirumala

Courtney Furnival

Miguel A Salcedo

A circuit to modulate the power supply to track input or output voltages provided to or output by a plurality of amplifiers to reduce power dissipation is provided. The circuit may include a peak detection circuit configured to receive a plurality of voltages respectively corresponding to the plurality of amplifiers, and to detect and output information regarding a maximum instantaneous voltage from the received plurality of voltages, and a summing circuit configured to output a sum of the information regarding the maximum instantaneous voltage and an amplifier headroom voltage. A reference voltage may be provided for the supply voltage responsive to the output sum. The circuit may also include a scaling circuit configured to scale the output sum, and the reference voltage may be a scaled reference voltage output by the scaling circuit.

Method and apparatus for modulating amplifier supply voltage for reducing power dissipation

A packaged device is obtained using an innovative package approach that allows integration of miniature planar magnetics into standard low-cost semiconductor packages (BGA, PDIP, SOIC, etc.) with electronic and electrical components, where those components can be C&W and/or SMD types. The packaged device includes a planar magnetic substrate having first and second dielectric layers, the first dielectric layer having a first winding defined thereon, the second dielectric layer having a second winding defined thereon. A magnetic component is provided in the substrate. A package material provided at least partly around the substrate and the magnetic component to protect the substrate and magnetic component. The magnetic component is an inductor or transformer. The packaged device further includes at least one semiconductor component provided on the first dielectric layer.

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Santa Clara, CA, United States of America

Donald Humbert