Honeywell International Inc.

Donald Horkheimer

Paul S Fechner

David S Willits

Jacob Weinmann

A method is provided. The method of resetting a system, comprising: receiving data from the electronic sub-system; determine if a non-hardware fault is detected; if a non-hardware fault is detected, then performing a software reset of the electronics sub-system; if no non-hardware fault has been detected, then determining if a hardware fault is detected; and if a hardware fault is detected, then performing a hardware reset of the system.

Method and apparatus for detecting and remedying single event effects

An ion sensor apparatus comprises at least one ion sensitive field effect transistor (ISFET) device configured to be exposed to a liquid, a reference electrode configured to contact the liquid to which the ISFET device is exposed, and at least one magnet configured to intermittently expose the ISFET device to a magnetic field. A processor is operatively connected to the ISFET device and the reference electrode. The processor modulates the magnetic field to produce a corresponding modulated output in resistance of the ISFET device, and modulation of a reported output value of the ion sensor apparatus.

Magnetic stimulus of ISFET-based sensor to enable trimming and self-compensation of sensor measurement errors

Embodiments described herein provide for a pH sensor that comprises a substrate and an ion sensitive field effect transistor (ISFET) die. The ISFET die includes an ion sensing part that is configured to be exposed to a medium such that it outputs a signal related to the pH level of the medium. The ISFET die is bonded to the substrate with at least one composition of bonding agent material disposed between the ISFET die and the substrate. One or more strips of the at least one composition of bonding agent material is disposed between the substrate and the ISFET die in a first pattern.

ph sensor with bonding agent disposed in a pattern

Embodiments described herein provide for a pH sensor that is configured for use over a pressure and temperature range. The ISFET die of the pH sensor is bonded to the substrate of the pH sensor with a bonding layer that is disposed between the substrate and the ISFET die. The pressure and temperature change across the pressure and temperature range generates an environmental force in the pH sensor. Further, the substrate or the bonding layer or both change volume over the pressure and temperature range, and the substrate or the bonding layer or both are configured such that the volume change induces a counteracting force that opposes at least a portion of the environmental force. The counteracting force is configured to maintain the change in piezoresistance of the ISFET die from the drain to the source to less than 0.5% over the pressure and temperature range.

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Minneapolis, MN, United States of America

Donald Horkheimer