Adhesives Research, Inc.

Henkel IP Holding Gmbh

Henkel US IP Lcc

Henkel Ag & Company, Kgaa

Arkema France

Donald Herr

Laxmisha Sridhar

Shengqian Kong

Allison Yue Xiao

Thomas W Hazell

Jie Cao

Robert M Wigdorski

Sharon Chaplinsky

Brian A Harkins

Andrew Slark

Christina T Nolen

Thomas R Gordon

Laxmisha M Sridhar

A UV light curable adhesive is disclosed, comprising, at least one bi-active monomer, at least one polymerizable oligomer, a primary photoinitiator, and a monomer scavenger, wherein photopolymerization of the at least one bi-active monomer by the primary photoinitiator activates the monomer scavenger, reducing residual monomer content in a cured adhesive formed by the photopolymerization of the bi-active monomer in comparison to an otherwise identical comparative UV adhesive lacking the monomer scavenger. A method for curing the UV light curable adhesive is disclosed, including applying the UV light curable adhesive to a surface and exposing the UV light curable adhesive to UV light, free from heating the UV light curable adhesive other than any autogenous increases in temperature from exothermic polymerization reactions. A device with the UV light cured adhesive is disclosed, including the UV light cured adhesive joining a first surface to a second surface.

UV light curable adhesive and device with UV light curable adhesive

A reactive pressure sensitive adhesive composition is disclosed. A tape formed using the reactive pressure sensitive adhesive is also disclosed. In its cured state, the pressure sensitive adhesive shows superior mechanical and electrical properties compared to conventional, non-curable charge collection tapes. The tape has a cure profile pre-selected to correspond to that of a photovoltaic cell fabrication process, such that curing can take place during cell fabrication and may occur simultaneously with one or more other curing steps employed in cell fabrication.

Reactive conductive pressure-sensitive adhesive tape

An actinic radiation activated, thermally curable solid film adhesive is disclosed that includes a film forming polymeric binder, a cationically curable resin, and a cationic photoinitiator. The solid film adhesive is capable of being processed at temperatures up to 120&#xb0; C. prior to exposure to actinic radiation without curing, has a latency period at room temperature following activation of the initiator, and is curable at temperatures above 50&#xb0; C. following activation of the initiator.

Reactive film adhesive

A radiation curable temporary laminating adhesive composition for use in temperature applications at 150&#xb0; C. or greater, and typically at 200&#xb0; C. or greater, comprises (A) a hydrogenated polybutadiene diacrylate; (B) a radical photoinitiator; and (C) a diluent.

Radiation curable temporary laminating adhesive for use in high temperature applications

The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.

Thermally reversible hot melt adhesive composition containing multifunctional diene and dienophile compounds

Growing community of inventors

Lancaster, PA, United States of America

Donald Herr