Hitachi Global Storage Technologies Netherlands B.v.

International Business Machines Corporation

Hgst Netherlands, B.v.

Donald Giles Allen

Wen-Chien David Hsiao

Aron Pentek

Michael R Feldbaum

Yi Zheng

Amanda Baer

Katalin Pentek

Vladimir Nikitin

Liubo Hong

Edward Hin Pong Lee

Yingjian Chen

Hung-Chin Guthrie

Honglin Zhu

Fenglin Liu

Andrew Chiu

Kyusik Shin

Richard Jule Contreras

Qiping Zhong

Jennifer Ai-Ming Leung

Edward H P Lee

Louis Joseph Serrano

Ming Jiang

Murali Ramasubramanian

Yimin Hsu

Sue Siyang Zhang

Kirk Barrows Price

Ning Shi

Quan-chiu Harry Lam

Yinshi Liu

Terence Tin-Lok Lam

Hieu Lam

Thomas J A Roucoux

Robert M Browne

Aaron Neuhaus

Jennifer Leung

Thomas Roucoux

Dominic Frank Truchetta

Hank Reinstein

Todd Thomas

Robert A Holleran

Steve C Puga

Depositing a seed layer for a high-moment shield onto a write pole may have a deleterious effect on the magnetic response of the write pole. Instead, an amorphous separation layer may be deposited between the write pole and the seed layer. In one embodiment, the seed layer is formed directly on the amorphous layer. In addition to separating the seed layer from the write pole, the amorphous separation layer permits the seed layer to dictate the crystallographic orientation of the shield which is subsequently deposited on the magnetic head. That is, the amorphous layer provides a substrate that allows the seed layer to have a crystalline structure independent of the layers that were deposited previously. The amorphous separation layer may comprise an amorphous metal&#x2014;e.g., NiNb or NiTa&#x2014;or an insulative material&#x2014;e.g., alumina or silicon dioxide.

Shield with uniform magnetic properties for a perpendicular magnetic recording head

A magnetic write head having a tapered trailing edge and having a magnetic layer formed over a trailing edge of the write pole at a location recessed from the ABS, the magnetic layer being separated from the trailing edge of the write pole by a thin non-magnetic layer. The thin non-magnetic layer is preferably sufficiently thin that the magnetic layer can function as a portion of the write pole in a region removed from the ABS. A trailing magnetic shield is formed over the write pole and is separated from the write pole by a non-magnetic trailing gap layer. A non-magnetic spacer layer can be formed over the magnetic layer to provide additional separation between the magnetic layer and the trailing magnetic shield.

Magnetic write head manufactured by an enhanced damascene process producing a tapered write pole with a non-magnetic spacer and non-magnetic bump

Methods for fabrication of tapered magnetic poles with a non-magnetic front bump layer. A magnetic pole may have a plurality of tapered surfaces at or near an air bearing surface (ABS), wherein a thickness of the write pole increases in a direction away from the ABS. A non-magnetic front bump layer may be formed on one or more of the tapered surfaces of the magnetic pole at a distance from the ABS. The front bump layer may increase the separation distance between a shield layer and the magnetic pole near the tapered surface, thereby improving the performance of the write head.

Magnetic head with flared write pole having multiple tapered regions

Methods of fabricating magnetic write heads and electrical lapping guides (ELG's) using a split gap deposition process is described. A removal process is performed on a magnetic material to define a main write pole and to define a corresponding ELG for the main write pole. A first non-magnetic gap layer is deposited. A mask and liftoff process is performed to deposit an electrically conductive material on the first gap layer disposed along a front edge of the ELG. A second non-magnetic gap layer is then deposited and a shield is fabricated for the write pole.

Magnetic write head fabrication with integrated electrical lapping guides

According to one embodiment, a system comprises an upper yoke having a first length defined between a pole tip thereof and a back gap thereof. In addition, the system includes a lower yoke having a second length defined between a pole tip thereof and a back gap thereof, the second length being greater than the first length. Also, the system includes coil turns in the upper and lower yokes. Additional systems and methods are also presented.

Write head with different upper and lower yoke lengths and methods for making the same

A method for manufacturing a magnetic write head having a leading magnetic shield and a trailing magnetic shield that are arranged to prevent the lost of magnetic write field to the trailing magnetic shield. The write head includes a non-magnetic step layer that provides additional spacing between the trailing magnetic shield and the write pole at a region removed from the air bearing surface.

Method for manufacturing a magnetic write head having a wrap around shield that is magnetically coupled with a leading magnetic shield

Methods and structures for the fabrication of both thin film longitudinal and perpendicular write heads are disclosed. A unique feature of these write heads is the inclusion of layered return poles, which comprise alternating layers of 22/78 and 80/20 NiFe alloys. The alternating layers also vary in thickness, the 22/78 NiFe layers having a nominal thickness of 1500 angstroms and the 80/20 NiFe layers having a nominal thickness of about 75 angstroms. Head efficiency and signal to noise ratios are significantly improved in heads having layered return pole construction.

Layered return poles for magnetic write heads

A perpendicular magnetic recording write head has a write pole, a trapezoidal-shaped trailing shield notch, and a metal gap layer between the write pole and notch. The write pole has a trailing edge that has a width substantially defining the track width and that faces the front edge of the notch but is spaced from it by the gap layer. The write head is fabricated by reactive ion beam etching of a thin mask film above the write pole to remove the mask film and widen the opening at the edges of the write pole. The gap layer and notch are deposited into the widened opening above the write pole. The write pole has nonmagnetic filler material, such as alumina, surrounding it except at its trailing edge, where it is in contact with the gap layer, which is formed of a different material than the surrounding filler material.

Method of manufacturing a perpendicular magnetic recording write head with notched trailing shield

A magnetic recording head for use in perpendicular magnetic recording having a design that allows the write coil to be manufactured by a damascene process for increased coil pitch and reduced coil resistance. The magnetic write head includes a photoresist dam structure that allows a hard baked photoresist to be formed that does not extend to the air bearing surface (ABS). Since the photoresist dam prevents the hard baked photoresist from reaching the ABS, the damascene process, in which the hard baked photoresist remains in the finished write head, can be used to produce the write head. The use of such a damascene process advantageously allows the space between the coil turns to be reduced, which maximizes the number of turns that can be used and also maximizes the number width to which the coil turns can be constructed, thereby minimizing the electrical resistance of the write coil.

Perpendicular magnetic recording head with photoresist dam between write coil and air bearing surface

A magnetic write head for perpendicular magnetic recording having a write pole with a concave trailing edge. The magnetic write pole can have a trapezoidal shape with first and second laterally opposed sides that are further apart at the trailing edge than at the leading edge. The write head may or may not include a magnetic trailing shield, and if a trailing shield is included it is separated from the trailing edge by a non-magnetic write gap layer. The concave trailing edge improves magnetic performance such as by improving the transition curvature. A method for constructing the write head includes forming a magnetic write pole by forming a mask structure over a deposited write pole material, the mask structure having an alumina hard mask and an image transfer layer such as DURAMIDE&#xae;. An alumina fill layer is then deposited and a chemical mechanical polish is performed to open up the image transfer layer. A reactive on etch is performed to remove the image transfer layer and a reactive ion mill or reactive ion etch is performed to remove the alumina hard mask and form a concave surface on the write pole.

Perpendicular magnetic write head having a magnetic write pole with a concave trailing edge

A method for making a write pole in a perpendicular magnetic recording write head uses a metal mask to pattern the primary resist and only ion milling during the subsequent patterning steps. A layer of primary resist is deposited over the magnetic write pole material and a metal mask layer is deposited on the primary resist layer. An imaging resist layer is formed on the metal mask layer and lithographically patterned generally in the desired shape of the write pole. Ion milling without a reactive gas is then performed over the imaging resist pattern to pattern the underlying metal mask layer, which is then used as the mask to define the shape of the primary resist pattern. Ion milling with oxygen is then performed over the metal mask pattern to pattern the underlying primary resist. Ion milling without a reactive gas is then performed over the primary resist pattern to form the underlying write pole.

Method for making a perpendicular magnetic recording write head

An improved damascene method of forming a write coil of a magnetic head. The method includes the steps of forming a hard mask layer over an insulator layer; forming a photoresist layer over the hard mask layer; performing an image patterning process to produce a write coil pattern in the photoresist layer; etching to remove portions of the hard mask layer in accordance with the write coil pattern; etching to remove portions of the insulator layer in accordance with the write coil pattern; etching to remove the remaining portion of the etched hard mask layer; after removing the etched hard mask layer, electroplating a material within the etched portion of the insulator material; and performing a chemical-mechanical polishing (CMP) process over the electroplated material. By removing the remainder of the hard mask material before the CMP, the quality of the CMP is improved.

Damascene method for forming write coils of magnetic heads

To remove unwanted electrostatic charge from a substrate or substrate clamping mechanism in a plasma processing chamber following the plasma processing of the substrate, the process of shutting down the RF power supply is altered. Specifically, the present invention is a stepped RF power shut down sequence in which the RF power is lowered in a first step from full power to approximately 5 to 10 watts for a short period of time, such as approximately 1 second, and thereafter the RF power is turned off. As a result of this RF power shut down sequence, with its intermediate step, the plasma during the intermediate step acts to neutralize or discharge the electrostatic charge that has built up upon the wafer and/or clamping mechanism during full power operation. When the electrostatic charge has been removed, the wafer sticking problem is resolved.

Prevention of electrostatic wafer sticking in plasma deposition/etch tools

The present invention overcomes the drawbacks and limitations described above by providing a paddle assembly having a paddle that moves in a bidirectional fashion for agitating solution in a container of a plating cell. A follower is coupled to the paddle. The follower engages a rotatable cam and is propelled along the cam as the cam rotates. A drive mechanism rotates the cam.

Cam driven paddle assembly for a plating cell

A flat vacuum chuck for restraining semiconductor wafer substrates and the like during processing applies a vacuum through holes in the chuck in a timed sequence. The localized areas of the wafer adjacent to each of the holes adhere to the chuck in a pattern that is controlled in such a way so as to minimize any residual gaps therebetween. In one application, the vacuum sequencing pattern is analogous to smoothing a curled sheet of paper on a flat surface with both hands by starting at or near the center of the sheet and moving both hands outward along the surface until the sheet is flat. The vacuum may be applied to substrates to overcome all types of distortions, including symmetrical, asymmetrical, and multi-plane distortions, depending upon the orientation of the net internal stresses resulting from the layers deposited on the wafer. The sequenced application of the vacuum through the chuck holes can be timed by installing a solenoid valve on each of the vacuum tubes connected to the ports. Alternatively, the vacuum applied through the chuck holes can be controlled by a single valve via different length tubes between the valve and the surface of the chuck. The holes with the shorter tubes reach nominal vacuum pressure sooner than those with longer tubes.

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Morgan Hill, CA, United States of America

Donald Giles Allen