Isothermal Systems Research, Inc.

Other

Parker-hannifin Corporation

Credence Systems Corporation

Parker Intangibles LLC

Donald E Tilton

Charles Lester Tilton

Randall T Palmer

Tahir Cader

Bruce A Smetana

Jeffery K Weiler

Thomas D Weir

William J Beasley

Douglas W Miller

Ryan J Baddeley

George Joseph Wos

Howard Lee Davidson

Paul Allan Knight

Steven Kasapi

Nader Pakdaman

Nyles I Nettleton

Philip W Appel

Randal T Palmer

John D Schwarzkopf

Norman O Alder

Tony E Hyde

Jeffrey K Weiler

David H Knaggs

Nathan Stoddard

Kevin D Seaney

Angela R Maehren

Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.

Narrow gap spray cooling in a globally cooled enclosure

A combination spray and cold plate thermal management system for effectively thermally managing a heat producing device during startup. The combination spray and cold plate thermal management system includes a spray unit thermally managing a heat producing device and a coolant reservoir thermally connected to the heat producing device. The coolant reservoir includes a porous media with coolant channels for storing a volume of the waste coolant after spraying of coolant has terminated. The coolant reservoir is fluidly connected to the spray chamber within the spray unit to receive the waste coolant.

Combination spray and cold plate thermal management system

A thermal management system configured to maximize the potential of single and multiple atomizers to effectively cool microprocessors and other electronic devices. The thermal management system, which may be a heat spreader, provides surfaces that are disposed to increase the effectiveness of impinging coolant droplets, provide additional heat transfer area in some embodiments, and permit the efficient, customized and disparate thermal management of a recipient object of the thermal management.

Thermal management system for evaporative spray cooling

An azeotrope spray cooling system for utilizing an azeotrope coolant for improving the performance of a spray cooling system. An azeotrope coolant is utilized within a two-phase thermal management system for thermally managing one or more heat producing devices. The characteristics of the azeotrope coolant may be adjusted for various types of thermal management applications by altering the components of the azeotrope coolant.

Azeotrope spray cooling system

A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use in spray cooling electronic components. A plurality of pick-up ports is defined within the enclosure. In one implementation of the cooling system, an orifice size used in each of the pick-up ports results in withdrawal of fluid from submerged and non-submerged pick-up ports.

Passive fluid recovery system

A globally cooled computer system for providing liquid cooling to a plurality of electrical components. The globally cooled computer system includes an electronics unit having a plurality of electronics components attached to a plurality of cards and a card cage for providing structural support to the cards, a fluid management unit for pressurizing fluid within the electronics unit, a reservoir for collecting fluid from the electronics unit, a tubing system for distributing the fluid between the electronics unit and the fluid management unit, and a pressure equalization system connecting the electronics unit and the reservoir to equalize internal pressures between them.

Globally cooled computer system

A localized thermal management system for efficiently thermally managing a plurality of heat producing devices. The localized thermal management system includes a thermal management unit and a plurality of thermal vias in thermal communication with the thermal management unit. The thermal vias are further in thermal communication with a plurality of heat producing devices for conducting heat from the heat producing devices and transferring the heat to the thermal management unit.

Localized thermal management system

An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment heat exchanger system generally includes a heat exchanger attached near an air outlet of a support unit for a support rack, a thermal management unit fluidly connected to the heat exchanger, and a thermal conditioning unit fluidly connected to the thermal management unit and the heat exchanger. The thermal management unit directly thermally manages one or more electronic devices of the server mainboard while the heat exchanger thermally manages the exhaust air before the exhaust air exits through the outlet of the support unit of the computer server.

Electronics equipment heat exchanger system

A spray cooling system for transverse thin-film evaporative spray cooling in a narrow gap which generally includes a framework, a cooling cavity, a plurality of atomizers oriented to transversely spray coolant across the electronic components to be cooled, and preferably a vapor recirculation system and a reduction in cross section from the inlet or spray side to the exit side.

Spray cooling system for transverse thin-film evaporative spray cooling

An integrated three dimensional packaging and cooling system for cooling an electronic component system with dissimilar power densities and interfering signals.

Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules

A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.

Spray cooling system

An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attached to a substrate, a cap attached about the lid creating a heat dissipation chamber, and a semiconductor chip attached to the lid by a thermally conductive adhesive. The lid may or may not form a cavity about the semiconductor chip depending upon the substrate utilized. The lid preferably includes a plurality of fins extending from thereof defining a plurality of channels or a plurality of grooves thereby increasing the heat flux of the lid.

Growing community of inventors

Colton, WA, United States of America

Donald E Tilton