Shipley Company LLC

Donald E Storjohann

James G Shelnut

Martin William Bayes

Mark Lefebvre

Denis Morrissey

David Merricks

Jeffrey M Calvert

Eugene N Step

Leon Barstad

Robert A Schetty, Iii

Sven J Wiberg

Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.

Seed layer

Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.

Seed layer repair bath

Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.

Seed layer repair method

Methods and apparatus for controlling plating rates of electroless plating solutions. The invention provides for continuous monitoring and replenishment of a one or more components of an electroless plating solution on a real time basis. The invention can be characterized in part by use of a quartz crystal microbalance.

Methods and apparatus for maintaining electroless plating solutions

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Watertown, MA, United States of America

Donald E Storjohann