International Business Machines Corporation

Donald E Myers

Thomas J Walsh

Arthur Bross

Robert O Lussow

Julian G Cempa

Herbert R Anderson, Jr

Joseph D Peruffo

Krishna Gandhi Sachdev

Robert D Johnson

James A McDonald

Herbert W Anderson

Thomas J Walsh, Iii

James R Lyerla, Jr

James J Hedrick

An improved connection through a substrate layer is formed by embedding a conductive element such as a pin on one or more balls or spheres in a thermoplastic material which is preferably a liquid crystal polymer. The substrate may be heated to facilitate the embedding process in which material of the substrate layer is reflowed under pressure to retain the conductive element by means of a preload force. The formation of such connections with either pins or plural conductive elements allows independence of aspect ratio of the connection and, hence, feature size of conductive patterns on the substrate and the thickness of the substrate layer. Perfecting features of the substrate and method and apparatus for forming the substrate, embedding to a selected depth to form protrusions and recesses to assist in registration of a substrate layer with another substrate layer, metallization to form pads, improved connection between metallization patterns on the substrate and the conductive elements, the regulation of pressurization of substrate material by means of differently shaped dimples or a renewable surface and several alternative arrangements for positioning and embedding the conductive elements. Multiple types of conductive elements may be simultaneously embedded to different depths in a single substrate and from either or both sides thereof to form a variety of substrate structures.

Via and pad structure for thermoplastic substrates and method and

A method is provided for forming one or more electrical conductors in a multilayer structure such as a computer component during a punching operation. A conducting sheet is placed in direct contact with a sheet of a deformable dielectric material. A punch is used to form a conducting slug from the sheet and to simultaneously transfer the slug into the dielectric material. During the transfer operation, a portion of the dielectric material is displaced so as to cause a mechanical interference between the slug and dielectric material.

Method of direct transferring of electrically conductive elements into a

A single step electrical/mechanical connection process utilizes an adhesive layer (3 or 26) that is patterned on a substrate (1 or 21) to mechanically connect adjacent substrates in a multilayered structure (28) or to connect a pin (2) assembly to a device (5). In a preferred embodiment, the adhesive layer (3 or 26) and substrate (1 or 21) are made from materials which will undergo transesterification under heat and pressure to create a very strong bond therebetween. The adhesive layer (3 or 26) is positioned around and does not cover the solder (4) in the pin connector assembly or the alignment holes (24) in the molding/sheet (21), thereby allowing bonding metallurgy to make positive electrical connections between pins (2) and pads (6) and adjacent spheres (22) in a multilayered structure (28).

Single step electrical/mechanical connection process for connecting I/O

There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system. A ball may contact conductive traces on two levels of the insulating body and thereby provide an electrical connection between conductive traces. A method of manufacture of the connector system includes the steps of heating the plastic body to an elevated temperature, and driving the small metal balls through or against a respective conductive trace and into the plastic body which thereby captivates it. The conductive traces may be solder plated. After a ball is seated in contact with a conductive trace, the solder plating may be reflowed.

Method of manufacturing a high density connector system

There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system.

High density connector system

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Poughkeepsie, NY, United States of America

Donald E Myers