Gm Global Technolgoy Operations, Inc.

Delco Electronics Corporation

Donald E Lake

Thaddeus Schroeder

Bruno P Lequesne

Robert W Ward

John M Hart, Jr

George A Shinkle

Daniel I Feaster

John S Zgunda

A package for a magnetic field sensitive element, such as a magnetoresistor, includes at least two planar layers of a relatively stiff ferromagnetic material which is also electrically conductive. The layers have opposed edges which are in closely spaced relation to form a narrow gap therebetween. A terminal tab is integral with and extends from each layer. A magnetic field sensitive element is on a surface of at least one of the layers and preferably extends across the gap to be on both layers. The magnetic field sensitive element has a pair of contacts each of which is electrically connected to a separate one of the layers. A permanent magnet is mounted on and insulated from the surface of the layers opposite the magnetic field sensitive element. A protective layer of an insulating material may cover the magnetic field sensitive element and the layers with the terminal tabs extending therefrom.

Package for the magnetic field sensitive device

A pressure sensor element comprising a silicon chip having a diaphragm formed therein with piezoresistive strain responsive resistors is mounted in a housing of molded polyester material having a much different temperature coefficient of expansion than the chip. The chip is protected from thermally induced and other stresses by a mounting arrangement comprising a glass base secured to the housing by a soft adhesive which largely prevents stress being transmitted from the housing to the base, wherein the base has a short pedestal on which a glass die is mounted which, in turn, supports the silicon chip. The short pedestal adds localized rigidity to the base so that any stresses in the base are taken up outside the region of the pedestal. One face of the glass die is bonded to the base by a relatively soft epoxy to further inhibit stress transmission and the silicon chip is securedly bonded to the opposite face of the die. Contacts on the silicon chip are wire bonded to conductors which are insert molded in the housing.

Pressure sensor assembly

Growing community of inventors

Kokomo, IN, United States of America

Donald E Lake