Tektronix, Inc.

Donald E Kephart

John S Moore

William W Stein

Mark Windsor Roberson

Robert D Hinchliffe

Dorothy L Blazo

A method of fabricating a channel structure for a PALC display panel comprises providing a channel member having channels formed in its upper surface and two electrodes in each channel, masking one electrode in each channel while leaving the other electrode unmasked, depositing material on the unmasked electrode in each channel, and removing the mask from masked electrode in each channel.

Method of fabricating a channel member for a PALC display panel

A conductive refractory compound coating for electrodes is sputter resistant, very resistant to oxidation, and easy to apply by way of electrophoresis or screen printing. This structure is further enhanced by the presence of surface particles of electrically nonconductive ceramic material. When the cathode electrode is energized, electrically nonconductive material is penetrated by the electric field, which attracts secondary electrons out of the cathode electrode, thereby increasing the cathode's efficiency as an emitter of secondary electrons. More specifically, cathode electrodes are used in a plasma addressing structure. The coating is formed by approximately 5 nm particles, each comprised of a fused matrix of conductive and nonconductive particles co-deposited with frit particles by either electrophoresis or 'silk' screening. The coating is subsequently baked to fuse the frit and bond the electrophoretically deposited particles to the electrodes.

Sputter-resistant conductive coatings with enhanced emission of

A refractory compound coating (188) for electrodes is sputter resistant, has a low work function so that it is a good emitter of secondary electrons, is very resistant to oxidation, and is easy to apply by way of electrophoresis. More specifically, cathode electrodes (162) are used in a plasma addressing structure (10). The coating is preferably formed by electrophoretic deposition of particles (184) of at least one refractory compound along with a frit. The coating is subsequently baked to fuse the frit and bond the electrophoretically deposited particles to the electrodes.

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Portland, OR, United States of America

Donald E Kephart