National Starch and Chemical Investment Holding Corporation

Henkel Ag & Company, Kgaa

Henkel Corporation

Donald E Herr

Rose Ann Schultz

Osama M Musa

Charles Willard Paul

Chaodong Xiao

Ziyi Hu

Robert W R Humphreys

Yuxia Liu

Nikola A Nikolic

Jie Cao

Sharon Chaplinsky

Scott R McLaughlin

Pingyong Xu

UV curable compositions, polymeric photoinitiators and precursors therefor are described.

Polymeric photoinitiators

A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.

Radiation-curable desiccant-filled adhesive/sealant

Sulfonium salt photoinitiator compositions, precursors useful in the preparation of such photoinitiators and the use of these photoinitiators in, e.g., UV curable adhesives, UV curable sealants, UV curable coating compositions, such as printing inks and varnishes, and UV curable encapsulants.

Sulfonium salt photoinitiators and use thereof

Electron donor compounds, suitable for use as adhesives or as components in adhesives, contain a carbon to carbon double bond attached to an aromatic ring and conjugated with the unsaturation in the aromatic ring.

Curable electron donor compositions

Sulfonium salt photinitiators and use thereof

Versatile synthetic methodology has been established for the production of a variety of siloxane and silane-containing radial epoxy resins and intermediates. This chemical approach has been exploited to obtain a variety of hybrid organic/inorganic materials that can be described as epoxysiloxane or epoxysilane radial copolymers. The methodology can be used to access reactive, hydrophobic Si-containing resins with good organic compatibility that are structurally distinct from epoxy-functional siloxanes/silanes known in the prior art. These hybrid radial epoxy resins may be utilized for a variety of adhesive and coating applications including radiation and thermally curable sealants, encapsulants and adhesives.

Epoxy-functional hybrid copolymers

Curable electron donor compounds

Compounds with both vinyl ether and carbamate, thiocarbamate or urea functionality are suitable for use in microelectronics applications and show enhanced adhesive strength compared to compounds that do not contain carbamate, thiocarbamate or urea functionality.

Die attach adhesives with vinyl ether and carbamate or urea functionality

Allylated amide compounds are formulated into curable compositions with a free radical curing agent, and optionally, one or more fillers, for use as adhesives in the manufacture of microelectronic devices.

Allylated amide compounds and die attach adhesives prepared therefrom

A thermoplastic or thermosetting adhesive for bonding an electronic component to a substrate in which the adhesive is cured in situ from a curable composition comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.

Dye attach adhesives for use in microelectronic devices

Underfill encapsulants are prepared from allylated amide compounds and a curing initiator.

Underfill encapsulants prepared from allylated amide compounds

This invention relates to underfill encapsulant compositions prepared from allylated amide compounds to protect and reinforce the interconnections between an electronic component and a substrate in a microelectronic device.

Growing community of inventors

Doylestown, PA, United States of America

Donald E Herr