Rohm & Haas Electronic Materials LLC

Donald E Cleary

Mark Lefebvre

Erik Reddington

Gonzalo Urrutia Desmaison

Maria Anna Rzeznik

Alejo M Lifschitz Arribio

Kristen M Milum

Zukra I Niazimbetova

Zukhra I Niazimbetova

Jacek M Knop

John G Carter

Select carboxymethyl-thio compounds are added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.

Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Stable electroless copper plating baths include di-cation viologen compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.

Electroless copper plating compositions and methods for electroless plating copper on substrates

A specific cysteine derivative is added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.

Catalysts include five-membered nitrogen containing heterocyclic compounds as ligands for metal ions which have catalytic activity. The catalysts are used to electrolessly plate metal on metal clad and un-clad substrates.

Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds

Catalysts include nanoparticles of catalytic metal and gallic acid or gallic acid derivatives or salts thereof. The catalysts are used in electroless metal plating. The catalysts are free of tin.

Stable catalysts for electroless metallization

Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Metal plating compositions and methods

Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.

Plating method

Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

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Littleton, MA, United States of America

Donald E Cleary