Lam Research Corporation

Ontrak Systems, Inc.

Intel Corporation

Donald E Anderson

Mike Ravkin

Wilbur C Krusell

John M deLarios

Mansour Moinpour

Mohsen Salek

Lynn S Ryle

Julia S Svirchevski

Roy Winston Pascal

Young C Park

Helmuth W Treichel

Tanlin K Dickey

Tom Bramblett

Douglas S Gardner

Hoang Viet Nguyen

Hoang T Nguyen

James H Hammar

A brush core and the method for making a brush core for use in substrate scrubbing are provided. The substrate can be any substrate that may need to undergo a scrubbing operation to complete a cleaning operation, etching operation, or other preparation. For instance, the substrate can be a semiconductor wafer, a disk, or any other type of work piece that will benefit from a brush core that can deliver uniform controlled amounts of fluid through the brush along an entire length of the brush core. The brush core is defined by a tubular core having a length that extends between a first end and a second end. The first end has an opening into a bore that is defined through a middle of the tubular core and extends along an inner length of the tubular core. A first plurality of holes are oriented along a plurality of first lines that extend in the direction of the length of the tubular core, and each of the first plurality of holes define paths to the bore of the tubular core. A second plurality of holes are oriented along a plurality of second lines that extend in the direction of the length of the tubular core, and each of the second plurality of holes define paths to the core of the tubular core. The plurality of first lines and the plurality of second lines alternate and the holes of the first and second plurality of holes are equally spaced apart. The holes of the second plurality of holes are offset relative to the holes of the first plurality of holes.

Wafer scrubbing brush core

An apparatus for cleaning edges of substrates is described. The present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based on friction and/or a difference in tangential velocity at a point of contact between the wafer and the cleaning mechanism.

Apparatus for cleaning edges of contaminated substrates

A method and apparatus for cleaning edges of substrates is described. The present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based on friction and/or a difference in tangential velocity at a point of contact between the wafer and the cleaning mechanism.

Method and apparatus for cleaning edges of contaminated substrates

An improved wafer holder with spindle assembly and wafer holder actuator is disclosed. In one embodiment, the vertical motion of a shaft drives an arm positioning member in a rotational motion. The arm positioning member is coupled to a first position of an arm such that the arm moves in a horizontal motion when the arm positioning member rotates. A substrate holding member is coupled to the arm at a second position, such that the horizontal motion of the arm moves the substrate holding member between an open and a closed position. The shaft of the above described embodiment is moved in a vertical motion by an actuator. A first cylinder of the actuator expands and engages a spring which moves the shaft upward and a second cylinder of the actuator retracts to disengage the first cylinder thereby moving the shaft downward.

Wafer holder with spindle assembly and wafer holder actuator

Golf bag cooler pack

Growing community of inventors

Morgan Hill, CA, United States of America

Donald E Anderson